公开(公告)号：US11842974B2

公开(公告)日：2023-12-12

申请号：US16612883

申请日：2018-05-11

Applicant: Alpha Assembly Solutions Inc.

Inventor： Angelo Gulino ,  Bogdan Bankiewicz ,  Oscar Khaselev ,  Anna Lifton ,  Michael T. Marczi ,  Girard Sidone ,  Paul Salerno ,  Paul J. Koep

IPC: H01L23/00 ,  B23K35/26 ,  B23K35/30 ,  C22C13/00 ,  B23K101/42

CPC classification number: H01L24/29 ,  B23K35/262 ,  B23K35/302 ,  C22C13/00 ,  H01L24/83 ,  B23K2101/42 ,  H01L2224/29209 ,  H01L2224/29211 ,  H01L2224/29216 ,  H01L2224/29239 ,  H01L2224/29247 ,  H01L2224/29311 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/83815 ,  H01L2924/014 ,  H01L2924/0105 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01078 ,  H01L2924/01082

Abstract: A solder material comprising a solder alloy and a thermal conductivity modifying component. The solder material has a bulk thermal conductivity of between about 75 and about 150 W/m-K and is usable in enhancing the thermal conductivity of the solder, allowing for optimal heat transfer and reliability in electronic packaging applications.

公开(公告)号：US20250111324A1

公开(公告)日：2025-04-03

申请号：US18897145

申请日：2024-09-26

Applicant: Alpha Assembly Solutions Inc.

Inventor： Paul Salerno ,  Anna Lifton ,  Howard Jin ,  Eric Bradley ,  Bruce Moloznik ,  Julia Murray

IPC: G06Q10/0639 ,  G06Q50/04

Abstract: A graphical user interface (GUI) to communication evidenced-based value propositions to a customer The tool is capable of presenting interactively compelling evidenced based value and enables engagement of various integrated solutions that can be tailored to specific customer needs. Thus, the tool of the present invention is desired to demonstrate an interface of various integrated solutions to provide evidence-based value propositions for evaluation and consideration by the customer.