- 专利标题: Semiconductor device and method of manufacturing the semiconductor device
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申请号: US17496300申请日: 2021-10-07
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公开(公告)号: US11843037B2公开(公告)日: 2023-12-12
- 发明人: Dukhyun Choe , Jinseong Heo , Yunseong Lee , Sanghyun Jo
- 申请人: Samsung Electronics Co., Ltd.
- 申请人地址: KR Suwon-si
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR Gyeonggi-do
- 代理机构: Harness, Dickey & Pierce, P.L.C.
- 优先权: KR 20210036079 2021.03.19 KR 20210040542 2021.03.29
- 主分类号: H01L29/40
- IPC分类号: H01L29/40 ; H01L29/78 ; H01L29/49 ; H01L29/51 ; H01L29/66 ; H10K10/46
摘要:
Provided are a semiconductor device and a method of manufacturing the semiconductor device. The semiconductor device includes a substrate, a channel layer at least one of on or in the substrate, an insulation layer on the substrate, a ferroelectric layer on the insulation layer, a fixed charge layer on an interface between the insulation layer and the ferroelectric layer, the fixed charge layer including charges of a first polarity, and a gate on the ferroelectric layer.
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