Embodiments herein describe techniques for a semiconductor device including a transistor. The transistor includes a first metal contact as a source electrode, a second metal contact as a drain electrode, a channel area between the source electrode and the drain electrode, and a third metal contact aligned with the channel area as a gate electrode. The first metal contact may be located in a first metal layer along a first direction. The second metal contact may be located in a second metal layer along the first direction, in parallel with the first metal contact. The third metal contact may be located in a third metal layer along a second direction substantially orthogonal to the first direction. The third metal layer is between the first metal layer and the second metal layer. Other embodiments may be described and/or claimed.