Invention Grant
- Patent Title: Semiconductor device with airgap spacer formation from backside of wafer
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Application No.: US17485580Application Date: 2021-09-27
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Publication No.: US11848384B2Publication Date: 2023-12-19
- Inventor: Ruilong Xie , Julien Frougier , Kangguo Cheng , Chanro Park
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Ryan, Mason & Lewis, LLP
- Agent Samuel Waldbaum
- Main IPC: H01L29/94
- IPC: H01L29/94 ; H01L29/76 ; H01L29/78 ; H01L21/8234 ; H01L23/522 ; H01L23/528 ; H01L27/088 ; H01L29/06 ; H01L29/66

Abstract:
A semiconductor structure includes a substrate and a field effect transistor disposed on the substrate. The field effect transistor includes a vertical fin, source and drain regions separated by a gate region, a gate structure disposed over the gate region and a gate airgap spacer at least partially disposed about the gate structure.
Public/Granted literature
- US20230110073A1 AIRGAP SPACER OF FINFET DEVICE WITH BACKSIDE BPR AND POWER DISTRIBUTION NETWORK Public/Granted day:2023-04-13
Information query
IPC分类: