- 专利标题: Mounting structure of thermal management module for vehicle
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申请号: US17725859申请日: 2022-04-21
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公开(公告)号: US11850911B2公开(公告)日: 2023-12-26
- 发明人: Yeonho Kim , Gee Young Shin , Jae Yeon Kim , Jeawan Kim , Jung Sam Gu , Jae Chun Ryu , Sung-Wook Park
- 申请人: HYUNDAI MOTOR COMPANY , Kia Corporation , HANON SYSTEMS
- 申请人地址: KR Seoul
- 专利权人: HYUNDAI MOTOR COMPANY,KIA CORPORATION,HANON SYSTEMS
- 当前专利权人: HYUNDAI MOTOR COMPANY,KIA CORPORATION,HANON SYSTEMS
- 当前专利权人地址: KR Seoul; KR Seoul; KR Daejeon
- 代理机构: MORGAN, LEWIS & BOCKIUS LLP
- 优先权: KR 20210117444 2021.09.03
- 主分类号: B60H1/00
- IPC分类号: B60H1/00 ; B60H1/32
摘要:
A mounting structure of a thermal management module for a vehicle, includes: a mounting carrier mounted at a front of a vehicle body and having a receiving space; and a thermal management module mounted in the receiving space; wherein the thermal management module includes: an air conditioner mounted in the receiving space and configured to adjust a temperature of a vehicle interior according to a cooling mode or a heating mode; and a cooling device mounted in the receiving space and configured to heat-exchange with a working fluid using an external air introduced from outside of the cooling device.
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