Mounting structure of cooling device for vehicle

    公开(公告)号:US12043106B2

    公开(公告)日:2024-07-23

    申请号:US17950368

    申请日:2022-09-22

    IPC分类号: B60K11/04

    CPC分类号: B60K11/04

    摘要: A mount structure of a cooling device for a vehicle includes first mounting units respectively provided at an upper part on left and right sides of the cooling device along a width direction of the vehicle and disposed toward a front-rear direction, the width direction, or a height direction of the vehicle, second mounting units respectively provided at a lower part on the left and right sides of the cooling device along the width direction of the vehicle and disposed toward the front-rear direction, the width direction, or the height direction of the vehicle, and a bush unit to which the first mounting units and the second mounting units are mounted to mount the cooling device to a vehicle body of the vehicle.

    Mounting Structure of Cooling Device for Vehicle

    公开(公告)号:US20230391183A1

    公开(公告)日:2023-12-07

    申请号:US17950368

    申请日:2022-09-22

    IPC分类号: B60K11/04

    CPC分类号: B60K11/04

    摘要: A mount structure of a cooling device for a vehicle includes first mounting units respectively provided at an upper part on left and right sides of the cooling device along a width direction of the vehicle and disposed toward a front-rear direction, the width direction, or a height direction of the vehicle, second mounting units respectively provided at a lower part on the left and right sides of the cooling device along the width direction of the vehicle and disposed toward the front-rear direction, the width direction, or the height direction of the vehicle, and a bush unit to which the first mounting units and the second mounting units are mounted to mount the cooling device to a vehicle body of the vehicle.

    Mounting structure of thermal management module for vehicle

    公开(公告)号:US11807070B2

    公开(公告)日:2023-11-07

    申请号:US17544348

    申请日:2021-12-07

    IPC分类号: B60H1/00

    CPC分类号: B60H1/00535

    摘要: A mounting structure of a thermal management module for a vehicle according to an embodiment of the present disclosure includes: front side members extending along a length direction of a vehicle and disposed on left and right sides of the vehicle, respectively, in a width direction of the vehicle; a dash reinforcement crossmember extending along the width direction of the vehicle and coupled to rear ends of the front side members on the left and right sides based on a front and rear direction of the vehicle; a crossmember dividing a space formed by the front side members into two spaces in the front and rear direction of the vehicle; and at least one mounting bracket, on which the thermal management module is mounted, configured to mount the thermal management module in one of the two spaces divided by the crossmember.

    Heat pump system for vehicle
    10.
    发明授权

    公开(公告)号:US12030367B2

    公开(公告)日:2024-07-09

    申请号:US18166634

    申请日:2023-02-09

    IPC分类号: B60H1/32

    CPC分类号: B60H1/3228 B60H1/3205

    摘要: A heat pump system includes a cooling apparatus in which a coolant is circulated, a compressor to compress a refrigerant, a condenser connected to the compressor through a refrigerant line and configured to condense the refrigerant by heat-exchanging with the refrigerant and the coolant, an evaporator connected to the condenser through the refrigerant line and configured to evaporate the refrigerant by heat-exchanging with the refrigerant and the coolant, a gas injection device provided in the refrigerant line between the condenser and the evaporator and configured to selectively expand and flow the refrigerant and selectively supply some of the refrigerant to the compressor, a refrigerant connection line including a first end connected to the refrigerant line and a second end connected to the gas injection device between the compressor and the evaporator, and a chiller in the refrigerant connection line for adjusting a temperature of the coolant by heat-exchange.