Invention Grant
- Patent Title: System for processing substrate
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Application No.: US17243954Application Date: 2021-04-29
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Publication No.: US11856680B2Publication Date: 2023-12-26
- Inventor: Sun Whan Kim , Byung Du Jeon
- Applicant: SEMES CO., LTD.
- Applicant Address: KR Chungcheongnam-do
- Assignee: Semes Co., Ltd.
- Current Assignee: Semes Co., Ltd.
- Current Assignee Address: KR Chungcheongnam-do
- Agency: RatnerPrestia
- Priority: KR 20200056971 2020.05.13
- Main IPC: H05F3/02
- IPC: H05F3/02 ; H01L21/67 ; H01L21/687 ; B08B3/02 ; B08B13/00

Abstract:
A substrate processing system capable of setting a stable reference ground level for electrical components while handling electrostatic discharge (ESD) is provided. The substrate processing system includes a first ground bar connected to a building ground; and a second ground bar connected to the building ground and physically separated from the first ground bar, wherein the first ground bar is connected to a first electrical component to set a ground level of the first electrical component, wherein the second ground bar is dedicated to a charged component, and the second ground bar is connected to the first charged component to set a path of the electrostatic discharge current generated by the first charged component.
Public/Granted literature
- US20210360767A1 SYSTEM FOR PROCESSING SUBSTRATE Public/Granted day:2021-11-18
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