Invention Grant
- Patent Title: Magnetic tunnel junction structures and related methods
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Application No.: US17735976Application Date: 2022-05-03
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Publication No.: US11856868B2Publication Date: 2023-12-26
- Inventor: Jun-Yao Chen , Chun-Heng Liao , Hung Cho Wang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Seed IP Law Group LLP
- Main IPC: H10N50/80
- IPC: H10N50/80 ; H10B61/00 ; H10N50/01

Abstract:
The present disclosure relates to a magneto-resistive random access memory (MRAM) cell having an extended upper electrode, and a method of formation. In some embodiments, the MRAM cell has a magnetic tunnel junction (MTJ) arranged over a conductive lower electrode. A conductive upper electrode is arranged over the magnetic tunnel junction. Below the conductive lower electrode is a first conductive via structure in a first dielectric layer. Below the conductive via structure is a discrete conductive jumper structure in a second dielectric layer. A dielectric body of a third dielectric material that is different from the first dielectric material and the second dielectric material extends vertical from the first dielectric layer at least partially into the second dielectric layer.
Public/Granted literature
- US20220263013A1 MAGNETIC TUNNEL JUNCTION STRUCTURES AND RELATED METHODS Public/Granted day:2022-08-18
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