Invention Grant
- Patent Title: Piezoelectric sensor and manufacturing method therefor, and electronic device
-
Application No.: US17414372Application Date: 2020-06-02
-
Publication No.: US11861931B2Publication Date: 2024-01-02
- Inventor: Yingming Liu , Haisheng Wang , Xiaoliang Ding , Lei Wang , Changfeng Li
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BOE Technology Group Co., Ltd.
- Current Assignee: BOE Technology Group Co., Ltd.
- Current Assignee Address: CN Beijing
- Agency: Chiwin Law LLC
- Priority: CN 1910553494.9 2019.06.25
- International Application: PCT/CN2020/093883 2020.06.02
- International Announcement: WO2020/259224A 2020.12.30
- Date entered country: 2021-06-16
- Main IPC: G06K9/00
- IPC: G06K9/00 ; G06V40/13 ; B06B1/06 ; H10K59/65 ; H10N30/045 ; H10N30/077 ; H10N30/857

Abstract:
A piezoelectric sensor, a manufacturing method thereof and an electronic device are provided. The piezoelectric sensor includes a substrate, an active layer, the active layer being disposed at a side of the substrate: a first electrode, the first electrode being disposed at a side of the active laver a wav from the substrate, and the first electrode including a plurality of sub-electrodes disposed at intervals: a piezoelectric layer, the piezoelectric layer being disposed at a side of the first electrode away from the active layer; and a second electrode, the second electrode being disposed at a side of the piezoelectric layer away from the first electrode. The active layer is configured to be capable of switching between an insulating state and a conducting state, and in the conducting state the active layer is capable of conducting the plurality of sub-electrodes.
Information query