Invention Grant
- Patent Title: Seal ring designs supporting efficient die to die routing
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Application No.: US17460806Application Date: 2021-08-30
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Publication No.: US11862481B2Publication Date: 2024-01-02
- Inventor: Sanjay Dabral , Chi Nung Ni , Long Huang , SivaChandra Jangam
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Aikin & Gallant, LLP
- Main IPC: H01L21/56
- IPC: H01L21/56 ; H01L25/065 ; H01L23/00
Abstract:
Chip sealing designs to accommodate die-to-die communication are described. In an embodiment, a chip structure includes a split metallic seal structure including a lower metallic seal and an upper metallic seal with overlapping metallization layers, and a through seal interconnect navigating through the split metallic seal structure.
Public/Granted literature
- US20220293433A1 Seal Ring Designs Supporting Efficient Die to Die Routing Public/Granted day:2022-09-15
Information query
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