Invention Grant
- Patent Title: Systems and methods for predicting film thickness of individual layers using virtual metrology
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Application No.: US17166288Application Date: 2021-02-03
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Publication No.: US11862520B2Publication Date: 2024-01-02
- Inventor: Bharath Ram Sundar , Raman K. Nurani , Utkarsha Avinash Dhanwate , Ramakrishnan S. Hariharan , Suresh Bharatharajan Kudallur , Vishwath Ram Amarnath
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Lowenstein Sandler LLP
- Main IPC: H01L21/66
- IPC: H01L21/66 ; G01N23/2251 ; G01N23/04 ; G06N20/00 ; G06F18/214

Abstract:
A method includes obtaining sensor data associated with a deposition process performed in a process chamber to deposit a film stack on a surface of a substrate, wherein the film stack comprises a plurality of layers of a first material and a plurality of layers of a second material. The method further includes obtaining metrology data associated with the film stack. The method further includes training a first machine-learning model based on the sensor data and the metrology data, wherein the first machine-learning model is trained to generate predictive metrology data associated with layers of the first material. The method further includes training a second machine-learning model based on the sensor data and the metrology data, wherein the second machine-learning model is trained to generate predictive metrology data associated with layers of the second material.
Public/Granted literature
- US20220246481A1 SYSTEMS AND METHODS FOR PREDICTING FILM THICKNESS OF INDIVIDUAL LAYERS USING VIRTUAL METROLOGY Public/Granted day:2022-08-04
Information query
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