- 专利标题： Electronic device and method of manufacturing the same
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申请号： US18059660申请日： 2022-11-29
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公开(公告)号： US11862704B2公开(公告)日： 2024-01-02
- 发明人: Jinseong Heo , Yunseong Lee , Sanghyun Jo , Keunwook Shin , Hyeonjin Shin
- 申请人： Samsung Electronics Co., Ltd.
- 申请人地址： KR Suwon-si
- 专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人地址： KR Gyeonggi-do
- 代理机构： Harness, Dickey & Pierce, P.L.C.
- 优先权： KR 20180111596 2018.09.18
- 分案原申请号： US17154354 2021.01.21
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; H01L29/51 ; H01L21/02
摘要：
Provided are electronic devices and methods of manufacturing the same. An electronic device may include a substrate, a gate electrode on the substrate, a ferroelectric layer between the substrate and the gate electrode, and a carbon layer between the substrate and the ferroelectric layer. The carbon layer may have an sp2 bonding structure.
公开/授权文献
- US11908918B2 Electronic device and method of manufacturing the same 公开/授权日：2024-02-20
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