Invention Grant
- Patent Title: Battery pack with overmolded busbars providing parallel cooling paths
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Application No.: US16915843Application Date: 2020-06-29
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Publication No.: US11862816B2Publication Date: 2024-01-02
- Inventor: Faruk A Sohag , Ethan T. Quy , Robert J. Schoenherr , Nicholas R. Bratton
- Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC
- Applicant Address: US MI Detroit
- Assignee: GM Global Technology Operations LLC
- Current Assignee: GM Global Technology Operations LLC
- Current Assignee Address: US MI Detroit
- Agency: Quinn IP Law
- Main IPC: H01M50/502
- IPC: H01M50/502 ; H01M10/6554 ; H01M10/613 ; H01M50/20 ; H01M10/48 ; H01M10/625 ; H01M10/647

Abstract:
A battery pack includes battery cells and an interconnect board assembly (ICBA) having a dielectric ICB and parallel busbars. A cell tab protrudes from an edge of the cells and joined to the busbars. A dielectric ICB is connected to the busbars at one distal end of the busbars. The dielectric material of the ICB is overmolded onto another distal end such that the ICB wraps around the busbars to form overmolded ends. The overmolded ends are received within a pocket of a bracket to form direct parallel cooling paths to a heat sink. A method of manufacturing the battery pack includes arranging the busbars in parallel, overmolding dielectric material onto ends of the busbars to form overmolded ends, and attaching the busbars to a plastic ICB formed from the dielectric material. The ICBA is then attached to the bracket and cells.
Public/Granted literature
- US20210408514A1 BATTERY PACK WITH OVERMOLDED BUSBARS PROVIDING PARALLEL COOLING PATHS Public/Granted day:2021-12-30
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