公开(公告)号：US11984566B2

公开(公告)日：2024-05-14

申请号：US17677393

申请日：2022-02-22

Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC

Inventor： Seth P. Mansfield ,  John M. Barnowsky ,  Ethan T. Quy ,  Matthew Pernot

IPC: H01M10/00 ,  H01M10/48 ,  H01M10/613 ,  H01M10/625 ,  H01M10/653

CPC classification number: H01M10/486 ,  H01M10/613 ,  H01M10/625 ,  H01M10/653 ,  H01M2220/20

Abstract: A cell temperature measurement system for a battery includes a heat spreader and a temperature sensor. The heat spreader is configured to thermally conduct energy through a substrate from a cell contact to a sensor contact. The temperature sensor is configured to generate a measurement reflective of a cell or another component temperature of the battery. The temperature sensor may generate the temperature measurement according to readings taken with a probe positioned proximate the sensor contact.

公开(公告)号：US20210408514A1

公开(公告)日：2021-12-30

申请号：US16915843

申请日：2020-06-29

Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC

Inventor： Faruk A. Sohag ,  Ethan T. Quy ,  Robert J. Schoenherr ,  Nicholas R. Bratton

IPC: H01M2/20 ,  H01M2/10 ,  H01M10/48 ,  H01M10/613 ,  H01M10/625 ,  H01M10/647 ,  H01M10/6554

Abstract: A battery pack includes battery cells and an interconnect board assembly (ICBA) having a dielectric ICB and parallel busbars. A cell tab protrudes from an edge of the cells and joined to the busbars. A dielectric ICB is connected to the busbars at one distal end of the busbars. The dielectric material of the ICB is overmolded onto another distal end such that the ICB wraps around the busbars to form overmolded ends. The overmolded ends are received within a pocket of a bracket to form direct parallel cooling paths to a heat sink. A method of manufacturing the battery pack includes arranging the busbars in parallel, overmolding dielectric material onto ends of the busbars to form overmolded ends, and attaching the busbars to a plastic ICB formed from the dielectric material. The ICBA is then attached to the bracket and cells.

公开(公告)号：US12021208B2

公开(公告)日：2024-06-25

申请号：US17027967

申请日：2020-09-22

Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC

Inventor： Ethan T. Quy ,  Nicholas R. Bratton ,  Harikrishna Ketha

IPC: H01M10/6554 ,  H01M10/613 ,  H01M10/625 ,  H01M10/6556 ,  H01M10/6568 ,  H01M50/20

CPC classification number: H01M10/6554 ,  H01M10/613 ,  H01M10/625 ,  H01M10/6556 ,  H01M10/6568 ,  H01M50/20 ,  H01M2220/20

Abstract: A battery pack module includes a cooling plate having thermal breaks strategically aligned with respect to adjacent cell chambers to reduce thermal propagation from one cell chamber to an adjacent cell chamber via thermal conductance through the cooling plate.

公开(公告)号：US11862816B2

公开(公告)日：2024-01-02

申请号：US16915843

申请日：2020-06-29

Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC

Inventor： Faruk A Sohag ,  Ethan T. Quy ,  Robert J. Schoenherr ,  Nicholas R. Bratton

IPC: H01M50/502 ,  H01M10/6554 ,  H01M10/613 ,  H01M50/20 ,  H01M10/48 ,  H01M10/625 ,  H01M10/647

CPC classification number: H01M50/502 ,  H01M10/482 ,  H01M10/613 ,  H01M10/625 ,  H01M10/647 ,  H01M10/6554 ,  H01M50/20 ,  H01M2220/20

Abstract: A battery pack includes battery cells and an interconnect board assembly (ICBA) having a dielectric ICB and parallel busbars. A cell tab protrudes from an edge of the cells and joined to the busbars. A dielectric ICB is connected to the busbars at one distal end of the busbars. The dielectric material of the ICB is overmolded onto another distal end such that the ICB wraps around the busbars to form overmolded ends. The overmolded ends are received within a pocket of a bracket to form direct parallel cooling paths to a heat sink. A method of manufacturing the battery pack includes arranging the busbars in parallel, overmolding dielectric material onto ends of the busbars to form overmolded ends, and attaching the busbars to a plastic ICB formed from the dielectric material. The ICBA is then attached to the bracket and cells.

公开(公告)号：US20240250325A1

公开(公告)日：2024-07-25

申请号：US18628085

申请日：2024-04-05

Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC

Inventor： Seth P. Mansfield ,  John M. Barnowsky ,  Ethan T. Quy ,  Matthew Pernot

IPC: H01M10/48 ,  H01M10/613 ,  H01M10/625 ,  H01M10/653

CPC classification number: H01M10/486 ,  H01M10/613 ,  H01M10/625 ,  H01M10/653 ,  H01M2220/20

Abstract: A cell temperature measurement system for a battery includes a heat spreader and a temperature sensor. The heat spreader is configured to thermally conduct energy through a substrate from a cell contact to a sensor contact. The temperature sensor is configured to generate a measurement reflective of a cell or another component temperature of the battery. The temperature sensor may generate the temperature measurement according to readings taken with a probe positioned proximate the sensor contact.

公开(公告)号：US20230268570A1

公开(公告)日：2023-08-24

申请号：US17677393

申请日：2022-02-22

Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC

Inventor： Seth P. Mansfield ,  John M. Barnowsky ,  Ethan T. Quy ,  Matthew Pernot

IPC: H01M10/48 ,  H01M10/613 ,  H01M10/625 ,  H01M10/653

CPC classification number: H01M10/486 ,  H01M10/613 ,  H01M10/625 ,  H01M10/653 ,  H01M2220/20

Abstract: A cell temperature measurement system for a battery includes a heat spreader and a temperature sensor. The heat spreader is configured to thermally conduct energy through a substrate from a cell contact to a sensor contact. The temperature sensor is configured to generate a measurement reflective of a cell or another component temperature of the battery. The temperature sensor may generate the temperature measurement according to readings taken with a probe positioned proximate the sensor contact.

公开(公告)号：US20220093989A1

公开(公告)日：2022-03-24

申请号：US17027967

申请日：2020-09-22

Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC

Inventor： Ethan T. Quy ,  Nicholas R. Bratton ,  Harikrishna Ketha

IPC: H01M10/6554 ,  H01M10/613 ,  H01M10/6556 ,  H01M10/6568 ,  H01M2/10 ,  H01M10/625

Abstract: A battery pack module includes a cooling plate having thermal breaks strategically aligned with respect to adjacent cell chambers to reduce thermal propagation from one cell chamber to an adjacent cell chamber via thermal conductance through the cooling plate.