Invention Grant
- Patent Title: Compensation of thermally induced voltage errors
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Application No.: US17587105Application Date: 2022-01-28
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Publication No.: US11876490B2Publication Date: 2024-01-16
- Inventor: Sandeep Shylaja Krishnan , Akshay Yashwant Jadhav , Tallam Vishwanath
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Ray A. King; Frank D. Cimino
- Priority: IN 2141016997 2021.04.12
- Main IPC: H03F1/30
- IPC: H03F1/30 ; G05F3/26

Abstract:
Described embodiments include an integrated circuit for temperature gradient compensation of a bandgap voltage. A bandgap core circuit has a bandgap feedback input, a bandgap adjustment input and a bandgap reference output. A resistor is coupled between the bandgap adjustment input and a ground terminal. An offset and slope correction circuit has an offset correction output that is coupled to the bandgap adjustment input. A signal at the offset correction output is trimmed at an ambient temperature. A thermal error cancellation (TEC) circuit has a TEC output coupled to the bandgap adjustment input. The TEC circuit includes first and second temperature sensors that are located apart from each other. A signal at the TEC output is responsive to temperatures at the first and second temperature sensors. An amplifier has an amplifier input and an amplifier output. The amplifier input is coupled to the bandgap reference output.
Public/Granted literature
- US20220329211A1 COMPENSATION OF THERMALLY INDUCED VOLTAGE ERRORS Public/Granted day:2022-10-13
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