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公开(公告)号：US11921535B2
公开(公告)日：2024-03-05
申请号：US17514433
申请日：2021-10-29
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Sandeep Shylaja Krishnan
IPC: G05F3/26
CPC classification number: G05F3/265
Abstract: A bandgap reference circuit includes an amplifier, a first transistor, a second transistor, a third transistor, a first resistor, and a second resistor. The amplifier is configured to generate a bandgap voltage. The first transistor is coupled to the amplifier, and passes a first PTAT current. The second transistor is coupled to the amplifier, and passes a second PTAT current. The first resistor is coupled to the amplifier and the second transistor, and passes the second PTAT current to the second transistor. The third transistor is coupled to the amplifier, and passes a third PTAT current that bypasses the first resistor and the second transistor. The second resistor is coupled to the first transistor, the second transistor, and the third transistor, and passes the first PTAT current, the second PTAT current, and the third PTAT current.
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公开(公告)号：US11914411B2
公开(公告)日：2024-02-27
申请号：US17314637
申请日：2021-05-07
Applicant: Texas Instruments Incorporated
Inventor： Sandeep Shylaja Krishnan , Tallam Vishwanath , Akshay Yashwant Jadhav
CPC classification number: G05F3/265 , G05F3/222 , G05F3/225 , G05F3/30 , H03F3/45179
Abstract: A bandgap reference circuit includes first through fourth bipolar junction transistors (BJTs). The base and collector of the first BJT are shorted together. The second BJT is coupled to the first BJT via a first resistor. The base of the third BJT is coupled to the base of the first BJT. The base and collector of the fourth BJT are coupled together and also are coupled to the base of the second BJT. A second resistor is coupled to the fourth emitter of the fourth BJT. A third resistor is coupled to the second resistor and to the emitter of the second BJT. An operational amplifier has a first input coupled to the first resistor and the collector of the second BJT, a second input coupled to the emitter of the third BJT and the collector of the fourth BJT, and an output coupled to the collectors of the first and third BJTs.
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公开(公告)号：US11302611B2
公开(公告)日：2022-04-12
申请号：US16202925
申请日：2018-11-28
Applicant: Texas Instruments Incorporated
Inventor： Barry Jon Male , Paul Merle Emerson , Sandeep Shylaja Krishnan
IPC: H01L23/495 , H01L23/00 , H01L21/56 , H01L23/31
Abstract: A packaged integrated circuit (IC) includes a leadframe including a die pad and leads around the die pad, an analog IC die having first bond pads on its active top side, and a second circuit including second circuit bond pads attached to the analog IC die by an attachment layer configured as a ring with a hollow center that provides an inner gap. A bottom side of the analog IC or the second circuit is attached to the die pad. Bond wires couple at least some of the first bond pads or some of the second circuit bond pads to the leads, and there is a second coupling between others of the second circuit bond pads and others of the first bond pads. A mold compound is for encapsulating the second circuit and the analog IC.
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公开(公告)号：US11837529B2
公开(公告)日：2023-12-05
申请号：US17698855
申请日：2022-03-18
Applicant: Texas Instruments Incorporated
Inventor： Barry Jon Male , Paul Merle Emerson , Sandeep Shylaja Krishnan
IPC: H01L23/495 , H01L23/00 , H01L21/56 , H01L23/31
CPC classification number: H01L23/49513 , H01L21/563 , H01L21/565 , H01L23/3114 , H01L23/4952 , H01L23/49548 , H01L24/09 , H01L24/17 , H01L24/32 , H01L24/49 , H01L24/73 , H01L2924/1304 , H01L2924/141
Abstract: A packaged integrated circuit (IC) includes a leadframe including a die pad and leads around the die pad, an analog IC die having first bond pads on its active top side, and a second circuit including second circuit bond pads attached to the analog IC die by an attachment layer configured as a ring with a hollow center that provides an inner gap. A bottom side of the analog IC or the second circuit is attached to the die pad. Bond wires couple at least some of the first bond pads or some of the second circuit bond pads to the leads, and there is a second coupling between others of the second circuit bond pads and others of the first bond pads. A mold compound is for encapsulating the second circuit and the analog IC.
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公开(公告)号：US11598795B1
公开(公告)日：2023-03-07
申请号：US17464261
申请日：2021-09-01
Applicant: Texas Instruments Incorporated
Inventor： Rajat Chauhan , Sandeep Shylaja Krishnan , Joseph Alan Sankman
Abstract: In an example method of trimming a voltage reference circuit, the method includes: setting the circuit to a first temperature; trimming a first resistor (RDEGEN) of a differential amplifier stage of the circuit; and trimming a first resistor (R1) of a scaling amplifier stage of the circuit. The trimming equalizes current flow through the differential amplifier stage and the scaling amplifier stage. The method includes: trimming a second resistor (R2) of the scaling amplifier stage to set an output voltage of the circuit to a target voltage at the first temperature; setting the circuit to a second temperature; and trimming a second resistor (RPTAT) of the differential amplifier stage, a third resistor (R1PTAT) of the scaling amplifier stage, and a fourth resistor (R2PTAT) of the scaling amplifier stage to set the output voltage of the circuit to the target voltage at the second temperature.
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Patent Agency Ranking
公开(公告)号：US10545522B2
公开(公告)日：2020-01-28
申请号：US15928395
申请日：2018-03-22
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Sandeep Shylaja Krishnan
Abstract: A voltage reference circuit includes a bandgap circuit and a temperature compensation circuit. The temperature compensation circuit includes a first trim circuit, a second trim circuit, and a resistive digital-to-analog converter. The resistive digital-to-analog converter is coupled to the first trim circuit, the second trim circuit, and the bandgap circuit. The resistive digital-to-analog converter is configured to generate a temperature compensation voltage, and to provide the temperature compensation voltage to the bandgap circuit.
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公开(公告)号：US12189411B2
公开(公告)日：2025-01-07
申请号：US18423948
申请日：2024-01-26
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Sandeep Shylaja Krishnan , Tallam Vishwanath , Akshay Yashwant Jadhav
Abstract: A bandgap reference circuit includes first through fourth bipolar junction transistors (BJTs). The base and collector of the first BJT are shorted together. The second BJT is coupled to the first BJT via a first resistor. The base of the third BJT is coupled to the base of the first BJT. The base and collector of the fourth BJT are coupled together and also are coupled to the base of the second BJT. A second resistor is coupled to the fourth emitter of the fourth BJT. A third resistor is coupled to the second resistor and to the emitter of the second BJT. An operational amplifier has a first input coupled to the first resistor and the collector of the second BJT, a second input coupled to the emitter of the third BJT and the collector of the fourth BJT, and an output coupled to the collectors of the first and third BJTs.
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公开(公告)号：US11929755B2
公开(公告)日：2024-03-12
申请号：US17513984
申请日：2021-10-29
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Tallam Vishwanath , Sandeep Shylaja Krishnan
Abstract: This description relates generally to piecewise temperature compensation. In an example, a circuit includes a knee code selector that can be configured to set a knee point temperature for a correction current responsive to a respective knee point temperature code of knee point temperature codes and a respective temperature sense signal of temperature sense signals. The circuit includes an output circuit that can be configured to provide the correction current responsive to the respective temperature sense signal and temperature voltages, and a trim digital to analog converter (DAC) that can be configured to provide a piecewise compensation current responsive to the correction current and a respective trim code of trim codes.
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公开(公告)号：US11876490B2
公开(公告)日：2024-01-16
申请号：US17587105
申请日：2022-01-28
Applicant: Texas Instruments Incorporated
Inventor： Sandeep Shylaja Krishnan , Akshay Yashwant Jadhav , Tallam Vishwanath
CPC classification number: H03F1/303 , G05F3/267 , H03F2200/375 , H03F2200/447 , H03F2200/468
Abstract: Described embodiments include an integrated circuit for temperature gradient compensation of a bandgap voltage. A bandgap core circuit has a bandgap feedback input, a bandgap adjustment input and a bandgap reference output. A resistor is coupled between the bandgap adjustment input and a ground terminal. An offset and slope correction circuit has an offset correction output that is coupled to the bandgap adjustment input. A signal at the offset correction output is trimmed at an ambient temperature. A thermal error cancellation (TEC) circuit has a TEC output coupled to the bandgap adjustment input. The TEC circuit includes first and second temperature sensors that are located apart from each other. A signal at the TEC output is responsive to temperatures at the first and second temperature sensors. An amplifier has an amplifier input and an amplifier output. The amplifier input is coupled to the bandgap reference output.
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公开(公告)号：US10353414B2
公开(公告)日：2019-07-16
申请号：US15856854
申请日：2017-12-28
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Sandeep Shylaja Krishnan
Abstract: In some examples, a bandgap reference circuit comprises a first bandgap pair having multiple first diodes and a first resistor positioned between the multiple first diodes. The circuit also comprises a second bandgap pair having multiple second diodes and a second resistor positioned between the multiple second diodes, the second bandgap pair being an inverted form of the first bandgap pair. The circuit further comprises a scaling resistor coupled to the first and second bandgap pairs. The circuit still further comprises an operational amplifier coupled to the first and second bandgap pairs.
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