Invention Grant
- Patent Title: Coreless organic packages with embedded die and magnetic inductor structures
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Application No.: US17524375Application Date: 2021-11-11
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Publication No.: US11881463B2Publication Date: 2024-01-23
- Inventor: Andrew J. Brown , Rahul Jain , Prithwish Chatterjee , Lauren A. Link , Sai Vadlamani
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Compass IP Law PC
- Main IPC: H01L25/00
- IPC: H01L25/00 ; H01L23/64 ; H01L23/538 ; H01L23/00 ; H01L21/48 ; H01L21/683 ; H01L21/78

Abstract:
A coreless semiconductor package comprises a plurality of horizontal layers of dielectric material. A magnetic inductor is situated at least partly in a first group of the plurality of layers. A plated laser stop is formed to protect the magnetic inductor against subsequent acidic processes. An EMIB is situated above the magnetic inductor within a second group of the plurality of layers. Vias and interconnections are configured within the horizontal layers to connect a die of the EMIB to other circuitry. A first level interconnect is formed on the top side of the package to connect to the interconnections. BGA pockets and BGA pads are formed on the bottom side of the package. In a second embodiment a polymer film is used as additional protection against subsequent acidic processes. The magnetic inductor comprises a plurality of copper traces encapsulated in magnetic material.
Public/Granted literature
- US20220068847A1 CORELESS ORGANIC PACKAGES WITH EMBEDDED DIE AND MAGNETIC INDUCTOR STRUCTURES Public/Granted day:2022-03-03
Information query
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