Invention Grant
- Patent Title: Printed circuit board and manufacturing method thereof, and electronic device
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Application No.: US17358768Application Date: 2021-06-25
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Publication No.: US11882665B2Publication Date: 2024-01-23
- Inventor: Zhengbao Sun , Xu Zhang , Bin Wang , Hai Hao , Lijun Peng
- Applicant: Huawei Technologies Co., Ltd.
- Applicant Address: CN Shenzhen
- Assignee: Huawei Technologies Co., Ltd.
- Current Assignee: Huawei Technologies Co., Ltd.
- Current Assignee Address: CN Shenzhen
- Agency: Slater Matsil, LLP
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K3/34 ; H05K1/18 ; H05K3/30
Abstract:
This application relates to the field of electronic technologies, and provides a printed circuit board and a manufacturing method thereof, and an electronic device. The printed circuit board has target holes that penetrate through the printed circuit board, and an area that is not provided with the target holes has blocking structures (B) for blocking liquid flow, where the area is on at least one side that is of the printed circuit board and that is connected to the target holes.
Public/Granted literature
- US20210329791A1 Printed Circuit Board and Manufacturing Method Thereof, and Electronic Device Public/Granted day:2021-10-21
Information query
