公开(公告)号：US20210329791A1

公开(公告)日：2021-10-21

申请号：US17358768

申请日：2021-06-25

Applicant: Huawei Technologies Co., Ltd.

Inventor： Zhengbao Sun ,  Xu Zhang ,  Bin Wang ,  Hai Hao ,  Lijun Peng

IPC: H05K3/34 ,  H05K1/18 ,  H05K1/11 ,  H05K3/30

Abstract: This application relates to the field of electronic technologies, and provides a printed circuit board and a manufacturing method thereof, and an electronic device. The printed circuit board has target holes that penetrate through the printed circuit board, and an area that is not provided with the target holes has blocking structures (B) for blocking liquid flow, where the area is on at least one side that is of the printed circuit board and that is connected to the target holes.

公开(公告)号：US11882665B2

公开(公告)日：2024-01-23

申请号：US17358768

申请日：2021-06-25

Applicant: Huawei Technologies Co., Ltd.

Inventor： Zhengbao Sun ,  Xu Zhang ,  Bin Wang ,  Hai Hao ,  Lijun Peng

IPC: H05K1/11 ,  H05K3/34 ,  H05K1/18 ,  H05K3/30

CPC classification number: H05K3/3447 ,  H05K1/115 ,  H05K1/184 ,  H05K3/306

Abstract: This application relates to the field of electronic technologies, and provides a printed circuit board and a manufacturing method thereof, and an electronic device. The printed circuit board has target holes that penetrate through the printed circuit board, and an area that is not provided with the target holes has blocking structures (B) for blocking liquid flow, where the area is on at least one side that is of the printed circuit board and that is connected to the target holes.