Invention Grant
- Patent Title: Electronics assembly for implantable medical device
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Application No.: US17071463Application Date: 2020-10-15
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Publication No.: US11883673B2Publication Date: 2024-01-30
- Inventor: Andrew J. Ries , Chunho Kim , Mark E. Henschel , Robert A. Munoz , Christopher T. Kinsey , Jeffrey S. Voss
- Applicant: Medtronic, Inc.
- Applicant Address: US MN Minneapolis
- Assignee: Medtronic, Inc.
- Current Assignee: Medtronic, Inc.
- Current Assignee Address: US MN Minneapolis
- Agency: Shumaker & Sieffert, P.A.
- Main IPC: A61N1/375
- IPC: A61N1/375

Abstract:
In some examples, an implantable medical device includes a battery, an electronics module electrically connected to the battery, and an elongated housing comprising a side wall positioned between the battery and an end cap, wherein the electronics module is positioned within the elongated housing between the battery and the end cap. The implantable medical device also includes an electrical contact assembly comprising a first spring contact and a second spring contact. The electrical contact assembly of the implantable medical device is positioned within the elongated housing between the electronics module and the battery or the end cap.
Public/Granted literature
- US20210121705A1 ELECTRONICS ASSEMBLY FOR IMPLANTABLE MEDICAL DEVICE Public/Granted day:2021-04-29
Information query
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