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    FEEDTHROUGH ASSEMBLY AND DEVICE INCLUDING SAME
    3.
    发明公开
    FEEDTHROUGH ASSEMBLY AND DEVICE INCLUDING SAME 审中-公开

    公开(公告)号：US20230218911A1

    公开(公告)日：2023-07-13

    申请号：US18124706

    申请日：2023-03-22

    申请人： Medtronic, Inc.

    发明人： Andrew J. Ries ,  Chunho Kim ,  Robert A. Munoz ,  Christopher T. Kinsey ,  Jeffrey Voss ,  Kris A. Peterson ,  Mark E. Henschel

    IPC分类号： A61N1/375

    CPC分类号： A61N1/3754 ,  A61N1/3756

    摘要： Various embodiments of a feedthrough header assembly and a device including such assembly are disclosed. The assembly includes a header having an inner surface and an outer surface; a dielectric substrate having a first major surface and a second major surface, where the second major surface of the dielectric substrate is disposed adjacent to the inner surface of the header; and a patterned conductive layer disposed on the first major surface of the dielectric substrate, where the patterned conductive layer includes a first conductive portion and a second conductive portion electrically isolated from the first conductive portion. The assembly further includes a feedthrough pin electrically connected to the second conductive portion of the patterned conductive layer and disposed within a via that extends through the dielectric substrate and the header. The feedthrough pin extends beyond the outer surface of the header.

    ELECTRONICS ASSEMBLY FOR IMPLANTABLE MEDICAL DEVICE
    4.
    发明申请
    ELECTRONICS ASSEMBLY FOR IMPLANTABLE MEDICAL DEVICE 有权

    公开(公告)号：US20210121705A1

    公开(公告)日：2021-04-29

    申请号：US17071463

    申请日：2020-10-15

    申请人： Medtronic, Inc.

    发明人： Andrew J. Ries ,  Chunho Kim ,  Mark E. Henschel ,  Robert A. Munoz ,  Christopher T. Kinsey ,  Jeffrey S. Voss

    IPC分类号： A61N1/375

    摘要： In some examples, an implantable medical device includes a battery, an electronics module electrically connected to the battery, and an elongated housing comprising a side wall positioned between the battery and an end cap, wherein the electronics module is positioned within the elongated housing between the battery and the end cap. The implantable medical device also includes an electrical contact assembly comprising a first spring contact and a second spring contact. The electrical contact assembly of the implantable medical device is positioned within the elongated housing between the electronics module and the battery or the end cap.

    ELECTRONICS ASSEMBLY FOR IMPLANTABLE MEDICAL DEVICE
    5.
    发明公开
    ELECTRONICS ASSEMBLY FOR IMPLANTABLE MEDICAL DEVICE 审中-公开

    公开(公告)号：US20240165416A1

    公开(公告)日：2024-05-23

    申请号：US18540100

    申请日：2023-12-14

    申请人： Medtronic, Inc.

    发明人： Andrew J. Ries ,  Chunho Kim ,  Mark E. Henschel ,  Robert A. Munoz ,  Christopher T. Kinsey ,  Jeffrey S. Voss

    IPC分类号： A61N1/375

    CPC分类号： A61N1/3754 ,  A61N1/37512

    摘要： In some examples, an implantable medical device includes a battery, an electronics module electrically connected to the battery, and an elongated housing comprising a side wall positioned between the battery and an end cap, wherein the electronics module is positioned within the elongated housing between the battery and the end cap. The implantable medical device also includes an electrical contact assembly comprising a first spring contact and a second spring contact. The electrical contact assembly of the implantable medical device is positioned within the elongated housing between the electronics module and the battery or the end cap.

    FEEDTHROUGH ASSEMBLY AND DEVICE INCLUDING SAME
    7.
    发明申请
    FEEDTHROUGH ASSEMBLY AND DEVICE INCLUDING SAME 有权

    公开(公告)号：US20210187307A1

    公开(公告)日：2021-06-24

    申请号：US17125250

    申请日：2020-12-17

    申请人： Medtronic, Inc.

    发明人： Andrew J. Ries ,  Chunho Kim ,  Robert A. Munoz ,  Christopher T. Kinsey ,  Jeffrey Voss ,  Kris A. Peterson ,  Mark E. Henschel

    IPC分类号： A61N1/375

    摘要： Various embodiments of a feedthrough header assembly and a device including such assembly are disclosed. The assembly includes a header having an inner surface and an outer surface; a dielectric substrate having a first major surface and a second major surface, where the second major surface of the dielectric substrate is disposed adjacent to the inner surface of the header; and a patterned conductive layer disposed on the first major surface of the dielectric substrate, where the patterned conductive layer includes a first conductive portion and a second conductive portion electrically isolated from the first conductive portion. The assembly further includes a feedthrough pin electrically connected to the second conductive portion of the patterned conductive layer and disposed within a via that extends through the dielectric substrate and the header. The feedthrough pin extends beyond the outer surface of the header.

    INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
    9.
    发明申请
    INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME 有权

    公开(公告)号：US20220157676A1

    公开(公告)日：2022-05-19

    申请号：US17592161

    申请日：2022-02-03

    申请人： Medtronic, Inc.

    发明人： Chunho Kim ,  Mark E. Henschel

    IPC分类号： H01L23/15 ,  H01L21/48 ,  H01L21/56 ,  H01L23/08 ,  H01L23/485 ,  H01L23/538 ,  H01L23/00

    摘要： Various embodiments of an integrated circuit package and a method of forming such package are disclosed. The package includes a substrate having a glass core layer, where the glass core layer includes a first major surface, a second major surface, and a cavity disposed between the first major surface and the second major surface of the glass core layer. The package also includes a die disposed in the cavity of the glass core layer, an encapsulant disposed in the cavity between the die and a sidewall of the cavity, a first patterned conductive layer disposed adjacent the first major surface of the glass core layer, and a second patterned conductive layer disposed adjacent the second major surface of the glass core layer. The die is electrically connected to at least one of the first and second patterned conductive layers.

    DIE CARRIER PACKAGE AND METHOD OF FORMING SAME
    10.
    发明申请
    DIE CARRIER PACKAGE AND METHOD OF FORMING SAME 有权

    公开(公告)号：US20210159131A1

    公开(公告)日：2021-05-27

    申请号：US17165005

    申请日：2021-02-02

    申请人： Medtronic, Inc.

    发明人： Mark R. Boone ,  Mark E. Henschel

    IPC分类号： H01L23/12 ,  H01L21/48 ,  H01L21/52 ,  H01L21/56 ,  H01L23/31 ,  H01L23/498 ,  H01L23/538 ,  H01L23/00 ,  H01L31/12

    摘要： Various embodiments of a die carrier package and a method of forming such package are disclosed. The package includes one or more dies disposed within a cavity of a carrier substrate, where a first die contact of one or more of the dies is electrically connected to a first die pad disposed on a recessed surface of the cavity, and a second die contact of one or more of the dies is electrically connected to a second die pad also disposed on the recessed surface. The first and second die pads are electrically connected to first and second package contacts respectively. The first and second package contacts are disposed on a first major surface of the carrier substrate adjacent the cavity.