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公开(公告)号：US11633611B2
公开(公告)日：2023-04-25
申请号：US17125250
申请日：2020-12-17
Applicant: Medtronic, Inc.
Inventor： Andrew J. Ries , Chunho Kim , Robert A. Munoz , Christopher T. Kinsey , Jeffrey Voss , Kris A. Peterson , Mark E. Henschel
IPC: A61N1/375
Abstract: Various embodiments of a feedthrough header assembly and a device including such assembly are disclosed. The assembly includes a header having an inner surface and an outer surface; a dielectric substrate having a first major surface and a second major surface, where the second major surface of the dielectric substrate is disposed adjacent to the inner surface of the header; and a patterned conductive layer disposed on the first major surface of the dielectric substrate, where the patterned conductive layer includes a first conductive portion and a second conductive portion electrically isolated from the first conductive portion. The assembly further includes a feedthrough pin electrically connected to the second conductive portion of the patterned conductive layer and disposed within a via that extends through the dielectric substrate and the header. The feedthrough pin extends beyond the outer surface of the header.
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公开(公告)号：US20240165416A1
公开(公告)日：2024-05-23
申请号：US18540100
申请日：2023-12-14
Applicant: Medtronic, Inc.
Inventor： Andrew J. Ries , Chunho Kim , Mark E. Henschel , Robert A. Munoz , Christopher T. Kinsey , Jeffrey S. Voss
IPC: A61N1/375
CPC classification number: A61N1/3754 , A61N1/37512
Abstract: In some examples, an implantable medical device includes a battery, an electronics module electrically connected to the battery, and an elongated housing comprising a side wall positioned between the battery and an end cap, wherein the electronics module is positioned within the elongated housing between the battery and the end cap. The implantable medical device also includes an electrical contact assembly comprising a first spring contact and a second spring contact. The electrical contact assembly of the implantable medical device is positioned within the elongated housing between the electronics module and the battery or the end cap.
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公开(公告)号：US11865639B2
公开(公告)日：2024-01-09
申请号：US17118283
申请日：2020-12-10
Applicant: Medtronic, Inc.
Inventor： David A. Ruben , Andreas Fenner , Andrew J. Ries , Robert A. Munoz , Christopher T. Kinsey , Mark E. Henschel
CPC classification number: B23K26/206 , A61N1/3754 , A61N1/3968 , B23K26/32
Abstract: Various embodiments of a hermetic assembly and a method of forming such assembly are disclosed. The hermetic assembly includes a dielectric substrate having a first major surface and a second major surface, a patterned layer connected to the first major surface of the dielectric substrate by a laser bond, and a ferrule having a body and a flange extending from the body. The flange is welded to a welding portion of the patterned layer that is disposed between the flange and the first major surface of the dielectric substrate such that the ferrule is hermetically sealed to the dielectric substrate.
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公开(公告)号：US20210187307A1
公开(公告)日：2021-06-24
申请号：US17125250
申请日：2020-12-17
Applicant: Medtronic, Inc.
Inventor： Andrew J. Ries , Chunho Kim , Robert A. Munoz , Christopher T. Kinsey , Jeffrey Voss , Kris A. Peterson , Mark E. Henschel
IPC: A61N1/375
Abstract: Various embodiments of a feedthrough header assembly and a device including such assembly are disclosed. The assembly includes a header having an inner surface and an outer surface; a dielectric substrate having a first major surface and a second major surface, where the second major surface of the dielectric substrate is disposed adjacent to the inner surface of the header; and a patterned conductive layer disposed on the first major surface of the dielectric substrate, where the patterned conductive layer includes a first conductive portion and a second conductive portion electrically isolated from the first conductive portion. The assembly further includes a feedthrough pin electrically connected to the second conductive portion of the patterned conductive layer and disposed within a via that extends through the dielectric substrate and the header. The feedthrough pin extends beyond the outer surface of the header.
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公开(公告)号：US12220590B2
公开(公告)日：2025-02-11
申请号：US18124706
申请日：2023-03-22
Applicant: Medtronic, Inc.
Inventor： Andrew J. Ries , Chunho Kim , Robert A. Munoz , Christopher T. Kinsey , Jeffrey Voss , Kris A. Peterson , Mark E. Henschel
IPC: A61N1/375
Abstract: Various embodiments of a feedthrough header assembly and a device including such assembly are disclosed. The assembly includes a header having an inner surface and an outer surface; a dielectric substrate having a first major surface and a second major surface, where the second major surface of the dielectric substrate is disposed adjacent to the inner surface of the header; and a patterned conductive layer disposed on the first major surface of the dielectric substrate, where the patterned conductive layer includes a first conductive portion and a second conductive portion electrically isolated from the first conductive portion. The assembly further includes a feedthrough pin electrically connected to the second conductive portion of the patterned conductive layer and disposed within a via that extends through the dielectric substrate and the header. The feedthrough pin extends beyond the outer surface of the header.
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Patent Agency Ranking
公开(公告)号：US20230218911A1
公开(公告)日：2023-07-13
申请号：US18124706
申请日：2023-03-22
Applicant: Medtronic, Inc.
Inventor： Andrew J. Ries , Chunho Kim , Robert A. Munoz , Christopher T. Kinsey , Jeffrey Voss , Kris A. Peterson , Mark E. Henschel
IPC: A61N1/375
CPC classification number: A61N1/3754 , A61N1/3756
Abstract: Various embodiments of a feedthrough header assembly and a device including such assembly are disclosed. The assembly includes a header having an inner surface and an outer surface; a dielectric substrate having a first major surface and a second major surface, where the second major surface of the dielectric substrate is disposed adjacent to the inner surface of the header; and a patterned conductive layer disposed on the first major surface of the dielectric substrate, where the patterned conductive layer includes a first conductive portion and a second conductive portion electrically isolated from the first conductive portion. The assembly further includes a feedthrough pin electrically connected to the second conductive portion of the patterned conductive layer and disposed within a via that extends through the dielectric substrate and the header. The feedthrough pin extends beyond the outer surface of the header.
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公开(公告)号：US20210121705A1
公开(公告)日：2021-04-29
申请号：US17071463
申请日：2020-10-15
Applicant: Medtronic, Inc.
Inventor： Andrew J. Ries , Chunho Kim , Mark E. Henschel , Robert A. Munoz , Christopher T. Kinsey , Jeffrey S. Voss
IPC: A61N1/375
Abstract: In some examples, an implantable medical device includes a battery, an electronics module electrically connected to the battery, and an elongated housing comprising a side wall positioned between the battery and an end cap, wherein the electronics module is positioned within the elongated housing between the battery and the end cap. The implantable medical device also includes an electrical contact assembly comprising a first spring contact and a second spring contact. The electrical contact assembly of the implantable medical device is positioned within the elongated housing between the electronics module and the battery or the end cap.
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公开(公告)号：US12233477B2
公开(公告)日：2025-02-25
申请号：US18404992
申请日：2024-01-05
Applicant: MEDTRONIC, INC.
Inventor： David A. Ruben , Andreas Fenner , Andrew J. Ries , Robert A Munoz , Christopher T. Kinsey , Mark E. Henschel
Abstract: Various embodiments of a hermetic assembly and a method of forming such assembly are disclosed. The hermetic assembly includes a dielectric substrate having a first major surface and a second major surface, a patterned layer connected to the first major surface of the dielectric substrate by a laser bond, and a ferrule having a body and a flange extending from the body. The flange is welded to a welding portion of the patterned layer that is disposed between the flange and the first major surface of the dielectric substrate such that the ferrule is hermetically sealed to the dielectric substrate.
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公开(公告)号：US20240131625A1
公开(公告)日：2024-04-25
申请号：US18404992
申请日：2024-01-05
Applicant: MEDTRONIC, INC.
Inventor： David A. Ruben , Andreas Fenner , Andrew J. Ries , Robert A. Munoz , Christopher T. Kinsey , Mark E. Henschel
CPC classification number: B23K26/206 , A61N1/3754 , A61N1/3968 , B23K26/32
Abstract: Various embodiments of a hermetic assembly and a method of forming such assembly are disclosed. The hermetic assembly includes a dielectric substrate having a first major surface and a second major surface, a patterned layer connected to the first major surface of the dielectric substrate by a laser bond, and a ferrule having a body and a flange extending from the body. The flange is welded to a welding portion of the patterned layer that is disposed between the flange and the first major surface of the dielectric substrate such that the ferrule is hermetically sealed to the dielectric substrate.
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公开(公告)号：US11883673B2
公开(公告)日：2024-01-30
申请号：US17071463
申请日：2020-10-15
Applicant: Medtronic, Inc.
Inventor： Andrew J. Ries , Chunho Kim , Mark E. Henschel , Robert A. Munoz , Christopher T. Kinsey , Jeffrey S. Voss
IPC: A61N1/375
CPC classification number: A61N1/3754 , A61N1/37512
Abstract: In some examples, an implantable medical device includes a battery, an electronics module electrically connected to the battery, and an elongated housing comprising a side wall positioned between the battery and an end cap, wherein the electronics module is positioned within the elongated housing between the battery and the end cap. The implantable medical device also includes an electrical contact assembly comprising a first spring contact and a second spring contact. The electrical contact assembly of the implantable medical device is positioned within the elongated housing between the electronics module and the battery or the end cap.
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