Invention Grant
- Patent Title: Apparatus and method for processing substrate
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Application No.: US17740358Application Date: 2022-05-10
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Publication No.: US11897006B2Publication Date: 2024-02-13
- Inventor: Ki Young Kwak , Sang Young Kwon , Cha Sub Shim
- Applicant: SEMES CO., LTD.
- Applicant Address: KR Chungcheongnam-do
- Assignee: SEMES CO., LTD.
- Current Assignee: SEMES CO., LTD.
- Current Assignee Address: KR Cheonan-si
- Agency: Ladas & Parry, LLP
- Priority: KR 20210067553 2021.05.26
- Main IPC: B08B3/02
- IPC: B08B3/02 ; B08B3/14 ; B08B3/08

Abstract:
The present disclosure provides a substrate processing apparatus and a substrate processing method. The substrate processing apparatus includes a substrate support unit configured to support a substrate, a liquid supply unit configured to supply a liquid containing any one of a chemical liquid and a cleaning liquid to the substrate supported by the substrate support unit, a processing container configured to accommodate the substrate support unit and recover the liquid supplied to the substrate from the liquid supply unit, and a capture module provided in the processing container to capture the liquid so as to suppress the liquid scattered from the substrate from being bounced back from the processing container and re-scattering.
Public/Granted literature
- US20220379351A1 APPARATUS AND METHOD FOR PROCESSING SUBSTRATE Public/Granted day:2022-12-01
Information query
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