公开(公告)号：US11897006B2

公开(公告)日：2024-02-13

申请号：US17740358

申请日：2022-05-10

Applicant: SEMES CO., LTD.

Inventor： Ki Young Kwak ,  Sang Young Kwon ,  Cha Sub Shim

IPC: B08B3/02 ,  B08B3/14 ,  B08B3/08

CPC classification number: B08B3/022 ,  B08B3/08 ,  B08B3/14 ,  B08B2203/0264

Abstract: The present disclosure provides a substrate processing apparatus and a substrate processing method. The substrate processing apparatus includes a substrate support unit configured to support a substrate, a liquid supply unit configured to supply a liquid containing any one of a chemical liquid and a cleaning liquid to the substrate supported by the substrate support unit, a processing container configured to accommodate the substrate support unit and recover the liquid supplied to the substrate from the liquid supply unit, and a capture module provided in the processing container to capture the liquid so as to suppress the liquid scattered from the substrate from being bounced back from the processing container and re-scattering.

公开(公告)号：US20220379351A1

公开(公告)日：2022-12-01

申请号：US17740358

申请日：2022-05-10

Applicant: SEMES CO., LTD.

Inventor： Ki Young KWAK ,  Sang Young Kwon ,  Cha Sub Shim

IPC: B08B3/02 ,  B08B3/08 ,  B08B3/14

Abstract: The present disclosure provides a substrate processing apparatus and a substrate processing method. The substrate processing apparatus includes a substrate support unit configured to support a substrate, a liquid supply unit configured to supply a liquid containing any one of a chemical liquid and a cleaning liquid to the substrate supported by the substrate support unit, a processing container configured to accommodate the substrate support unit and recover the liquid supplied to the substrate from the liquid supply unit, and a capture module provided in the processing container to capture the liquid so as to suppress the liquid scattered from the substrate from being bounced back from the processing container and re-scattering.