Invention Grant
- Patent Title: Low-temperature metal CMP for minimizing dishing and corrosion, and improving pad asperity
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Application No.: US16831436Application Date: 2020-03-26
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Publication No.: US11897079B2Publication Date: 2024-02-13
- Inventor: Haosheng Wu , Hari Soundararajan , Jianshe Tang , Shou-Sung Chang , Brian J. Brown , Yen-Chu Yang , You Wang , Rajeev Bajaj
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Fish & Richardson P.C.
- Main IPC: B24B37/015
- IPC: B24B37/015 ; B24B55/03 ; B24B37/10 ; H01L21/306 ; B24B49/14 ; B24B37/04
Abstract:
A chemical mechanical polishing system includes a platen to support a polishing pad having a polishing surface, a source of coolant, a dispenser having one or more apertures suspended over the platen to direct coolant from the source of coolant onto the polishing surface of the polishing pad; and a controller coupled to the source of coolant and configured to cause the source of coolant to deliver the coolant through the nozzles onto the polishing surface during a selected step of a polishing operation.
Public/Granted literature
- US20210046602A1 LOW-TEMPERATURE METAL CMP FOR MINIMIZING DISHING AND CORROSION, AND IMPROVING PAD ASPERITY Public/Granted day:2021-02-18
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