Invention Grant
- Patent Title: Method and apparatus for post exposure processing of photoresist wafers
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Application No.: US17468536Application Date: 2021-09-07
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Publication No.: US11899366B2Publication Date: 2024-02-13
- Inventor: Viachslav Babayan , Douglas A. Buchberger, Jr. , Qiwei Liang , Ludovic Godet , Srinivas D. Nemani , Daniel J. Woodruff , Randy Harris , Robert B. Moore
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan, LLP
- The original application number of the division: US16272962 2019.02.11
- Main IPC: G03F7/16
- IPC: G03F7/16 ; G03F7/26 ; G03F7/38 ; H01L21/67 ; G03F7/40 ; H01L21/687 ; G03F7/20

Abstract:
Embodiments described herein relate to methods and apparatus for performing immersion field guided post exposure bake processes. Embodiments of apparatus described herein include a chamber body defining a processing volume. A pedestal may be disposed within the processing volume and a first electrode may be coupled to the pedestal. A moveable stem may extend through the chamber body opposite the pedestal and a second electrode may be coupled to the moveable stem. In certain embodiments, a fluid containment ring may be coupled to the pedestal and a dielectric containment ring may be coupled to the second electrode.
Public/Granted literature
- US20220004104A1 METHOD AND APPARATUS FOR POST EXPOSURE PROCESSING OF PHOTORESIST WAFERS Public/Granted day:2022-01-06
Information query
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