Invention Grant
- Patent Title: Ion beam implantation method and semiconductor device
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Application No.: US17127309Application Date: 2020-12-18
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Publication No.: US11908694B2Publication Date: 2024-02-20
- Inventor: Moriz Jelinek , Michael Hell , Caspar Leendertz , Kristijan Luka Mletschnig , Hans-Joachim Schulze
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: COOPER LEGAL GROUP, LLC
- Priority: DE 2019135490 2019.12.20
- Main IPC: H01J37/317
- IPC: H01J37/317 ; H01L21/265 ; H01L21/04 ; H01L29/36

Abstract:
In an example, a substrate is oriented to a target axis, wherein a residual angular misalignment between the target axis and a preselected crystal channel direction in the substrate is within an angular tolerance interval. Dopant ions are implanted into the substrate using an ion beam that propagates along an ion beam axis. The dopant ions are implanted at implant angles between the ion beam axis and the target axis. The implant angles are within an implant angle range. A channel acceptance width is effective for the preselected crystal channel direction. The implant angle range is greater than 80% of a sum of the channel acceptance width and twofold the angular tolerance interval. The implant angle range is smaller than 500% of the sum of the channel acceptance width and twofold the angular tolerance interval.
Public/Granted literature
- US20210193435A1 ION BEAM IMPLANTATION METHOD AND SEMICONDUCTOR DEVICE Public/Granted day:2021-06-24
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