Invention Grant
- Patent Title: Method of crimping an electrical HF connection device
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Application No.: US17383925Application Date: 2021-07-23
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Publication No.: US11916346B2Publication Date: 2024-02-27
- Inventor: Olivier De Cloet
- Applicant: TE Connectivity Germany GmbH
- Applicant Address: DE Bensheim
- Assignee: TE Connectivity Germany GmbH
- Current Assignee: TE Connectivity Germany GmbH
- Current Assignee Address: DE Bensheim
- Agency: Barley Snyder
- Priority: DE 2020119624.5 2020.07.24
- Main IPC: H01R43/05
- IPC: H01R43/05 ; H01R9/05
Abstract:
A method for crimp mounting a high-frequency (HF) electrical crimp connecting device to an electrical cable includes the steps of crimping a ferrule into a mounting state wherein its maximum diameter is fixed, and arranging the ferrule in its mounting state over an exposed shielding conductor of the cable. A terminal is crimped onto an inner conductor of the cable, and a shielding contact sleeve is placed over the cable and crimped, at least in the area of the ferrule. A target impedance or impedance range of the resulting cable is set according to at least one of a dimension of at least one crimping tool used to perform the crimping steps, or at least one dimension of at least one of the resulting crimps performed by the at least one crimping tool.
Public/Granted literature
- US20220029371A1 Method of Crimping an Electrical HF Connection Device Public/Granted day:2022-01-27
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