A system for cooling an inductively coupled plasma (ICP) instrument includes: the ICP instrument; a pump in fluid communication with the instrument via a first conduit; and a micro-channel heat exchanger in fluid communication with the instrument via a second conduit, and in fluid communication with the pump via a third conduit. The pump is configured to generate a pump outlet pressure of coolant that exceeds a back pressure of the instrument such that a pressure of the coolant traveling through the second conduit and into the heat exchanger is less than or equal to 5 pounds per square inch (psi) above atmospheric pressure, as measured at an inlet to the heat exchanger.