- 专利标题： Substrate processing system, substrate processing method and computer-readable recording medium
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申请号： US16966909申请日： 2019-01-22
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公开(公告)号： US11929268B2公开(公告)日： 2024-03-12
- 发明人: Munehisa Kodama
- 申请人： Tokyo Electron Limited
- 申请人地址： JP Tokyo
- 专利权人： TOKYO ELECTRON LIMITED
- 当前专利权人： TOKYO ELECTRON LIMITED
- 当前专利权人地址： JP Tokyo
- 代理机构： Shih IP Law Group, PLLC.
- 优先权： JP 18018370 2018.02.05
- 国际申请： PCT/JP2019/001836 2019.01.22
- 国际公布： WO2019/151041A 2019.08.08
- 进入国家日期： 2020-08-03
- 主分类号： H01L21/67
- IPC分类号： H01L21/67 ; B08B3/10 ; B08B13/00 ; B24B37/10 ; H01L21/304 ; H01L21/677 ; H01L21/687
摘要：
A substrate processing system configured to process a substrate includes a carry-in/out unit configured to carry the substrate from/to an outside thereof; a processing unit configured to process a processing surface of the substrate; a cleaning unit provided between the carry-in/out unit and the processing unit when viewed from a top, and configured to clean the processing surface after being processed in the processing unit; a first transfer unit stacked on top of the cleaning unit, and configured to transfer the substrate; and a second transfer unit provided between the processing unit and the first transfer unit when viewed from the top, and configured to transfer the substrate. The first transfer unit transfers the substrate between the carry-in/out unit and the second transfer unit. The second transfer unit transfers the substrate between the first transfer unit and the processing unit and between the processing unit and the cleaning unit.
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