公开(公告)号：US10833045B2

公开(公告)日：2020-11-10

申请号：US15989633

申请日：2018-05-25

Applicant: Tokyo Electron Limited

Inventor： Yoshitaka Otsuka ,  Munehisa Kodama ,  Takashi Terada

IPC: H01L21/67 ,  H01L21/68 ,  H01L23/00 ,  H01L21/683

Abstract: A substrate processing apparatus 30 includes a first holding unit 200 configured to hold a processing target substrate W; a second holding unit 300 disposed to face the first holding unit 200 and configured to hold a support substrate S; and an ultraviolet irradiation unit 400 configured to irradiate an ultraviolet ray to an adhesive G provided between the processing target substrate W and the support substrate S. Each of the support substrate S and the second holding unit 300 is made of an ultraviolet transmissive material. An electrode 320 configured to electrostatically attract the support substrate S is provided within the second holding unit 300. A diffusion layer 330 configured to diffuse a transmission direction of the ultraviolet ray is provided at a position closer to the support substrate S between the support substrate S and the electrode 320 within the second holding unit 300.

公开(公告)号：US12142483B2

公开(公告)日：2024-11-12

申请号：US17295480

申请日：2019-11-11

Applicant: Tokyo Electron Limited

Inventor： Yoshihiro Kawaguchi ,  Seiji Nakano ,  Munehisa Kodama ,  Hirotoshi Mori ,  Hayato Tanoue ,  Yohei Yamawaki

IPC: H01L21/304 ,  B24B7/22 ,  H01L21/683

Abstract: A substrate processing apparatus configured to process a substrate includes a substrate holder configured to hold, in a combined substrate in which a first substrate and a second substrate are bonded to each other, the second substrate; a periphery removing unit configured to remove, starting from a periphery modification layer formed on the first substrate along a boundary between a peripheral portion to be removed and a central portion of the first substrate, the peripheral portion from the combined substrate held by the substrate holder; and a collection unit equipped with a collection mechanism configured to collect the peripheral portion removed by the periphery removing unit.

公开(公告)号：US20180342479A1

公开(公告)日：2018-11-29

申请号：US15989633

申请日：2018-05-25

Applicant: Tokyo Electron Limited

Inventor： Yoshitaka Otsuka ,  Munehisa Kodama ,  Takashi Terada

IPC: H01L23/00 ,  H01L21/67 ,  H01L21/683

Abstract: A substrate processing apparatus 30 includes a first holding unit 200 configured to hold a processing target substrate W; a second holding unit 300 disposed to face the first holding unit 200 and configured to hold a support substrate S; and an ultraviolet irradiation unit 400 configured to irradiate an ultraviolet ray to an adhesive G provided between the processing target substrate W and the support substrate S. Each of the support substrate S and the second holding unit 300 is made of an ultraviolet transmissive material. An electrode 320 configured to electrostatically attract the support substrate S is provided within the second holding unit 300. A diffusion layer 330 configured to diffuse a transmission direction of the ultraviolet ray is provided at a position closer to the support substrate S between the support substrate S and the electrode 320 within the second holding unit 300.

公开(公告)号：US11929268B2

公开(公告)日：2024-03-12

申请号：US16966909

申请日：2019-01-22

Applicant: Tokyo Electron Limited

Inventor： Munehisa Kodama

IPC: H01L21/67 ,  B08B3/10 ,  B08B13/00 ,  B24B37/10 ,  H01L21/304 ,  H01L21/677 ,  H01L21/687

CPC classification number: H01L21/67178 ,  B08B3/10 ,  B08B13/00 ,  B24B37/10 ,  H01L21/304 ,  H01L21/67161 ,  H01L21/67219 ,  H01L21/67748 ,  H01L21/68707

Abstract: A substrate processing system configured to process a substrate includes a carry-in/out unit configured to carry the substrate from/to an outside thereof; a processing unit configured to process a processing surface of the substrate; a cleaning unit provided between the carry-in/out unit and the processing unit when viewed from a top, and configured to clean the processing surface after being processed in the processing unit; a first transfer unit stacked on top of the cleaning unit, and configured to transfer the substrate; and a second transfer unit provided between the processing unit and the first transfer unit when viewed from the top, and configured to transfer the substrate. The first transfer unit transfers the substrate between the carry-in/out unit and the second transfer unit. The second transfer unit transfers the substrate between the first transfer unit and the processing unit and between the processing unit and the cleaning unit.

公开(公告)号：US11817337B2

公开(公告)日：2023-11-14

申请号：US17268116

申请日：2019-07-17

Applicant: Tokyo Electron Limited

Inventor： Munehisa Kodama

IPC: H01L21/677 ,  H01L21/67 ,  H01L21/687

CPC classification number: H01L21/67718 ,  H01L21/67028 ,  H01L21/67092 ,  H01L21/68714

Abstract: A substrate processing system includes a first main surface grinding device configured to grind, while holding a substrate from below with a first main surface of the substrate facing upwards, the first main surface of the substrate; a first inverting device configured to invert the substrate ground by the first main surface grinding device; and a second main surface grinding device configured to grin, while holding the ground first main surface of the substrate from below with a second main surface of the substrate facing upwards, the second main surface of the substrate.

公开(公告)号：US11417543B2

公开(公告)日：2022-08-16

申请号：US16508507

申请日：2019-07-11

Applicant: Tokyo Electron Limited

Inventor： Yoshitaka Otsuka ,  Munehisa Kodama ,  Yutaka Yamasaki

IPC: H01L21/67 ,  H01L21/683 ,  H01L21/20

Abstract: A bonding apparatus includes a first holder, a second holder, an imaging unit and a moving device. The first holder is configured to hold a first substrate. The second holder is disposed to face the first holder and configured to hold a second substrate to be bonded to the first substrate. The imaging unit includes a first imaging device configured to image a first alignment mark formed on a surface of the first substrate facing the second substrate and a second imaging device configured to image a second alignment mark formed on a surface of the second substrate facing the first substrate. The moving device is configured to move the imaging unit in a first direction and a second direction intersecting with the first direction within a plan region between the first holder and the second holder.

公开(公告)号：US12191153B2

公开(公告)日：2025-01-07

申请号：US17627147

申请日：2020-07-08

Applicant: Tokyo Electron Limited

Inventor： Munehisa Kodama ,  Tomohiro Kaneko

IPC: H01L21/306 ,  H01L21/02 ,  H01L21/67 ,  H01L21/687

Abstract: A substrate processing apparatus includes a pair of first substrate chucks each configured to hold a substrate from below while allowing a first main surface of the substrate to face upwards; a pair of second substrate chucks each configured to hold the substrate from below while allowing a second main surface of the substrate opposite to the first main surface to face upwards; a rotary table which is configured to be rotated about a rotation axis; a first processing unit equipped with a first processing tool configured to process the first main surface of the substrate held by the first substrate chuck; and a second processing unit equipped with a second processing tool configured to process the second main surface of the substrate held by the second substrate chuck.

公开(公告)号：US11858092B2

公开(公告)日：2024-01-02

申请号：US16624951

申请日：2018-06-07

Applicant: Tokyo Electron Limited

Inventor： Munehisa Kodama ,  Takahiro Sakamoto

IPC: B24B7/22 ,  H01L21/304 ,  H01L21/683 ,  H01L21/66 ,  B24B7/04 ,  B24B49/02 ,  B24B49/12

CPC classification number: B24B7/228 ,  B24B7/04 ,  B24B49/02 ,  B24B49/12 ,  H01L21/304 ,  H01L21/6836 ,  H01L22/26 ,  H01L2221/68327

Abstract: A substrate processing method of thinning a substrate having a protective tape attached on a front surface thereof includes measuring a thickness of the protective tape; and grinding, by using a grinder, a rear surface of the substrate held by a substrate holder.

公开(公告)号：US11120985B2

公开(公告)日：2021-09-14

申请号：US16765902

申请日：2018-11-09

Applicant: TOKYO ELECTRON LIMITED

Inventor： Munehisa Kodama

IPC: H01L21/683 ,  H01L21/02 ,  B24B37/27

Abstract: A substrate transfer device configured to transfer a substrate while holding a first surface of the substrate by a substrate holder and configured to deliver a second surface of the substrate is provided. The substrate transfer device includes a tilting mechanism configured to perform tilting of the substrate holder when viewed from a side; and a fixing mechanism configured to stop the tilting of the substrate holder when viewed from the side.

公开(公告)号：US20200020553A1

公开(公告)日：2020-01-16

申请号：US16508507

申请日：2019-07-11

Applicant: Tokyo Electron Limited

Inventor： Yoshitaka Otsuka ,  Munehisa Kodama ,  Yutaka Yamasaki

IPC: H01L21/67 ,  H01L21/20 ,  H01L21/683

Abstract: A bonding apparatus includes a first holder, a second holder, an imaging unit and a moving device. The first holder is configured to hold a first substrate. The second holder is disposed to face the first holder and configured to hold a second substrate to be bonded to the first substrate. The imaging unit includes a first imaging device configured to image a first alignment mark formed on a surface of the first substrate facing the second substrate and a second imaging device configured to image a second alignment mark formed on a surface of the second substrate facing the first substrate. The moving device is configured to move the imaging unit in a first direction and a second direction intersecting with the first direction within a plan region between the first holder and the second holder.