Invention Grant
- Patent Title: Workpiece placement apparatus and processing apparatus
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Application No.: US17811121Application Date: 2022-07-07
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Publication No.: US11942357B2Publication Date: 2024-03-26
- Inventor: Yohei Uchida , Naoki Sugawa , Katsushi Abe , Tsuyoshi Hida
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: IPUSA, PLLC
- Priority: JP 18041231 2018.03.07
- The original application number of the division: US16293788 2019.03.06
- Main IPC: H01L21/687
- IPC: H01L21/687 ; H01J37/32 ; H01L21/67 ; H01L21/683
Abstract:
A placement apparatus for placing a workpiece is provided. The placement apparatus includes a stage on which a workpiece can be placed in a processing vessel; an edge ring including a locking part which is disposed on the stage so as to surround a periphery of the workpiece; a conductive connecting member connected with the edge ring at the locking part; and a first contacting member configured to cause the edge ring to contact the stage, while the edge ring is connected with the connecting member.
Public/Granted literature
- US20220336257A1 WORKPIECE PLACEMENT APPARATUS AND PROCESSING APPARATUS Public/Granted day:2022-10-20
Information query
IPC分类:
