- 专利标题: Uneven-trench pixel cell and fabrication method
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申请号: US17220695申请日: 2021-04-01
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公开(公告)号: US11948965B2公开(公告)日: 2024-04-02
- 发明人: Hui Zang , Gang Chen
- 申请人: OmniVision Technologies, Inc.
- 申请人地址: US CA Santa Clara
- 专利权人: OmniVision Technologies, Inc.
- 当前专利权人: OmniVision Technologies, Inc.
- 当前专利权人地址: US CA Santa Clara
- 代理机构: COZEN O'CONNOR
- 主分类号: H01L27/146
- IPC分类号: H01L27/146 ; H01L27/148 ; H01L29/423
摘要:
An uneven-trench pixel cell includes a semiconductor substrate that includes a floating diffusion region, a photodiode region, and, between a front surface and a back surface: a first sidewall surface, a shallow bottom surface, a second sidewall surface, and a deep bottom surface. The first sidewall surface and a shallow bottom surface define a shallow trench, located between the floating diffusion region and the photodiode region, that extends into the semiconductor substrate from the front surface. A shallow depth of the shallow trench exceeds a junction depth of the floating diffusion region. The second sidewall surface and a deep bottom surface define a deep trench, located between the floating diffusion region and the photodiode region, that extends into the semiconductor substrate from the front surface. A distance between the deep bottom surface and the front surface defines a deep depth, of the deep trench, that exceeds the shallow depth.
公开/授权文献
- US20220320175A1 UNEVEN-TRENCH PIXEL CELL AND FABRICATION METHOD 公开/授权日:2022-10-06
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