Invention Grant
- Patent Title: Laser processing system
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Application No.: US16283130Application Date: 2019-02-22
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Publication No.: US11951562B2Publication Date: 2024-04-09
- Inventor: Yohei Kobayashi , Shuntaro Tani , Yutsuki Aoyagi
- Applicant: THE UNIVERSITY OF TOKYO
- Applicant Address: JP Tokyo
- Assignee: THE UNIVERSITY OF TOKYO
- Current Assignee: THE UNIVERSITY OF TOKYO
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP 18030874 2018.02.23
- Main IPC: B23K26/03
- IPC: B23K26/03 ; B23K26/0622 ; B23K26/064 ; B23K26/36 ; B23K26/362 ; B23K26/70 ; G06N3/08

Abstract:
A laser processing system is equipped with a processing laser beam irradiation device configured to irradiate a processing object with processing laser beam and perform ablation processing. The laser processing system is configured to obtain an ablation image of a processed portion of the processing object based on scattered light from the processed portion during processing of the processing object with the processing laser beam and to estimate an ablation volume by applying a learning result obtained by deep learning of a relationship between the ablation image and the ablation volume to the obtained ablation image.
Public/Granted literature
- US20190262936A1 LASER PROCESSING SYSTEM Public/Granted day:2019-08-29
Information query
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