Invention Grant
- Patent Title: Combined corrugated piezoelectric microphone and corrugated piezoelectric vibration sensor
-
Application No.: US18165014Application Date: 2023-02-06
-
Publication No.: US11962973B2Publication Date: 2024-04-16
- Inventor: Christian Bretthauer , David Tumpold , Pradyumna Mishra , Daniel Neumaier
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Slater Matsil, LLP
- The original application number of the division: US16896665 2020.06.09
- Main IPC: H04R17/02
- IPC: H04R17/02 ; B81B7/04 ; G01H11/08 ; G01P1/02 ; G01P15/08 ; G01P15/09 ; G01P15/18 ; H04R1/04 ; H04R1/28 ; H10N30/30 ; H10N30/87 ; H04R7/18 ; H04R17/10
Abstract:
A combined MicroElectroMechanical structure (MEMS) includes a first piezoelectric membrane having one or more first electrodes, the first piezoelectric membrane being affixed between a first holder and a second holder; and a second piezoelectric membrane having an inertial mass and one or more second electrodes, the second piezoelectric membrane being affixed between the second holder and a third holder.
Public/Granted literature
- US20230188899A1 COMBINED CORRUGATED PIEZOELECTRIC MICROPHONE AND CORRUGATED PIEZOELECTRIC VIBRATION SENSOR Public/Granted day:2023-06-15
Information query
