Invention Grant
- Patent Title: Polymer latex for dip-molding applications
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Application No.: US16086775Application Date: 2016-03-21
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Publication No.: US11965046B2Publication Date: 2024-04-23
- Inventor: Andrew Kells , Sören Butz , Alexandra Abele , Peter Shaw , Brian Saunders , Gareth Simpson
- Applicant: Synthomer Sdn. Bhd.
- Applicant Address: MY Kluang
- Assignee: Synthomer Sdn. Bhd.
- Current Assignee: Synthomer Sdn. Bhd.
- Current Assignee Address: MY Kluang
- Agency: The Webb Law Firm
- International Application: PCT/MY2016/000012 2016.03.21
- International Announcement: WO2017/164726A 2017.09.28
- Date entered country: 2018-09-20
- Main IPC: C08F293/00
- IPC: C08F293/00 ; B29C41/00 ; B29C41/14 ; C08F265/04 ; C09D5/02 ; C09D151/00 ; C09D153/02 ; B29K105/00 ; B29L31/48 ; C08F220/18

Abstract:
The present invention relates to a polymer latex for dip-molding applications obtainable by free-radical emulsion polymerization of a mixture of ethylenically unsaturated monomers comprising at least one conjugated diene and at least one ethylenically unsaturated nitrile compound in an aqueous medium in presence of seed latex particles having a glass transition temperature (mid point temperature Tmg) measured by DSC according to ASTM D3418-03 of −50° C. to 50° C. wherein the seed latex particles do not contain structural units derived from ethylenically unsaturated nitrile compounds, to a method of preparing said polymer latex, to articles made by using said polymer latex and to a method for preparing dip-molded articles from said polymer latex.
Public/Granted literature
- US20190092891A1 Polymer Latex for Dip-Molding Applications Public/Granted day:2019-03-28
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