Invention Grant
- Patent Title: Substrate treating apparatus and substrate treating method
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Application No.: US17017786Application Date: 2020-09-11
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Publication No.: US11977332B2Publication Date: 2024-05-07
- Inventor: Hae-Won Choi , Yerim Yeon , Anton Koriakin , Kihoon Choi , Youngran Ko , Jeong Ho Cho , Hyungseok Kang , Hong Gi Min
- Applicant: SEMES CO., LTD. , RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY
- Applicant Address: KR Cheonan-si
- Assignee: SEMES CO., LTD.,Research & Business Foundation SUNGKYUNKWAN UNIVERSITY
- Current Assignee: SEMES CO., LTD.,Research & Business Foundation SUNGKYUNKWAN UNIVERSITY
- Current Assignee Address: KR Chungcheongnam-do; KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR 20190112630 2019.09.11
- Main IPC: G03F7/16
- IPC: G03F7/16 ; G03F7/039 ; G03F7/32 ; H01L21/67
Abstract:
A substrate treating apparatus and a substrate treating method are provided. The substrate treating apparatus includes a first process chamber to apply an organic solvent to a substrate applied with a developer and introduced, and a second process chamber to treat the substrate applied with the organic solvent and introduced, through a supercritical fluid.
Public/Granted literature
- US20210072644A1 SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD Public/Granted day:2021-03-11
Information query
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