Invention Grant
- Patent Title: SRAM cell and logic cell design
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Application No.: US17883910Application Date: 2022-08-09
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Publication No.: US11980015B2Publication Date: 2024-05-07
- Inventor: Fang Chen , Kuo-Chiang Ting , Jhon Jhy Liaw , Min-Chang Liang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- The original application number of the division: US15170562 2016.06.01
- Main IPC: H10B10/00
- IPC: H10B10/00 ; G11C11/412 ; G11C11/417 ; H01L21/8238 ; H01L23/522 ; H01L23/528 ; H01L27/088 ; H01L49/02 ; H03K19/20 ; H10B43/27

Abstract:
An embodiment is an integrated circuit structure including a static random access memory (SRAM) cell having a first number of semiconductor fins, the SRAM cell having a first boundary and a second boundary parallel to each other, and a third boundary and a fourth boundary parallel to each other, the SRAM cell having a first cell height as measured from the third boundary to the fourth boundary, and a logic cell having the first number of semiconductor fins and the first cell height.
Public/Granted literature
- US20220383944A1 SRAM Cell and Logic Cell Design Public/Granted day:2022-12-01
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