Invention Grant
- Patent Title: Systems and methods for predicting film thickness using virtual metrology
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Application No.: US17139330Application Date: 2020-12-31
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Publication No.: US11989495B2Publication Date: 2024-05-21
- Inventor: Debkalpo Das , Raman K Nurani , Ramachandran Subramanian , Bibhavendra Singh , Bharath Sundar
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Lowenstein Sandler LLP
- Main IPC: G06F30/33
- IPC: G06F30/33 ; G06F18/213 ; G06F18/214 ; H01L21/70

Abstract:
A method includes obtaining sensor data associated with a deposition process performed in a process chamber to deposit film on a surface of a substrate. The method further includes generating a plurality of physics based outputs using a transformation function and the sensor data. The method further includes mapping the physics based outputs to a training set. The method further includes training a virtual model based on the training set and the sensor data, wherein the virtual model is trained to generate predictive metrology data associated with the film.
Public/Granted literature
- US20220207223A1 SYSTEMS AND METHODS FOR PREDICTING FILM THICKNESS USING VIRTUAL METROLOGY Public/Granted day:2022-06-30
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