SYSTEMS AND METHODS FOR PREDICTING FILM THICKNESS USING VIRTUAL METROLOGY

    公开(公告)号:US20220207223A1

    公开(公告)日:2022-06-30

    申请号:US17139330

    申请日:2020-12-31

    Inventor: Debkalpo Das

    Abstract: A method includes obtaining sensor data associated with a deposition process performed in a process chamber to deposit film on a surface of a substrate. The method further includes generating a plurality of physics based outputs using a transformation function and the sensor data. The method further includes mapping the physics based outputs to a training set. The method further includes training a virtual model based on the training set and the sensor data, wherein the virtual model is trained to generate predictive metrology data associated with the film.

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