Invention Grant
- Patent Title: Bonding structures in semiconductor packaged device and method of forming same
-
Application No.: US17813069Application Date: 2022-07-18
-
Publication No.: US11990428B2Publication Date: 2024-05-21
- Inventor: Hao Chun Liu , Ching-Wen Hsiao , Kuo-Ching Hsu , Mirng-Ji Lii
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- The original application number of the division: US16265136 2019.02.01
- Main IPC: H01L21/56
- IPC: H01L21/56 ; H01L21/78 ; H01L23/00 ; H01L23/31 ; H01L23/58
Abstract:
A semiconductor device and a method of forming the same are provided. The semiconductor device includes a die structure including a plurality of die regions and a plurality of first seal rings. Each of the plurality of first seal rings surrounds a corresponding die region of the plurality of die regions. The semiconductor device further includes a second seal ring surrounding the plurality of first seal rings and a plurality of connectors bonded to the die structure. Each of the plurality of connectors has an elongated plan-view shape. A long axis of the elongated plan-view shape of each of the plurality of connectors is oriented toward a center of the die structure.
Public/Granted literature
- US20220352094A1 BONDING STRUCTURES IN SEMICONDUCTOR PACKAGED DEVICE AND METHOD OF FORMING SAME Public/Granted day:2022-11-03
Information query
IPC分类:
