Invention Grant
- Patent Title: Fabrication of gate-all-around integrated circuit structures having pre-spacer deposition cut gates
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Application No.: US17030212Application Date: 2020-09-23
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Publication No.: US11990472B2Publication Date: 2024-05-21
- Inventor: Leonard P. Guler , Michael K. Harper , William Hsu , Biswajeet Guha , Tahir Ghani , Niels Zussblatt , Jeffrey Miles Tan , Benjamin Kriegel , Mohit K. Haran , Reken Patel , Oleg Golonzka , Mohammad Hasan
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H01L27/088
- IPC: H01L27/088 ; G11C5/06 ; H01L27/06 ; H01L29/06 ; H01L29/417 ; H01L29/66 ; H01L29/78

Abstract:
Gate-all-around integrated circuit structures having pre-spacer-deposition cut gates are described. For example, an integrated circuit structure includes a first vertical arrangement of horizontal nanowires and a second vertical arrangement of horizontal nanowires. A first gate stack is over the first vertical arrangement of horizontal nanowires, and a second gate stack is over the second vertical arrangement of horizontal nanowires. An end of the second gate stack is spaced apart from an end of the first gate stack by a gap. The integrated circuit structure also includes a dielectric structure having a first portion forming a gate spacer along sidewalls of the first gate stack, a second portion forming a gate spacer along sidewalls of the second gate stack, and a third portion completely filling the gap, the third portion continuous with the first and second portions.
Public/Granted literature
- US20220093592A1 FABRICATION OF GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING PRE-SPACER DEPOSITION CUT GATES Public/Granted day:2022-03-24
Information query
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