Invention Grant
- Patent Title: Package substrate and method for manufacturing the same
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Application No.: US17899553Application Date: 2022-08-30
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Publication No.: US11997798B2Publication Date: 2024-05-28
- Inventor: Wu Chou Hsu , Hsing Kuo Tien , Chih-Cheng Lee , Min-Yao Chen
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee Address: TW Kaohsiung
- Agency: FOLEY & LARDNER LLP
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H01L21/48 ; H01L23/10 ; H01L23/498 ; H01L23/544 ; H01L25/16 ; H01L25/18 ; H05K1/18 ; H05K3/30
Abstract:
A package substrate and manufacturing method thereof are provided. The package substrate includes a substrate and an electronic component. The substrate includes a cavity. The electronic component is disposed in the cavity. The electronic component includes a first region and a second region, and an optical recognition rate of the first region is distinct from that of the second region.
Public/Granted literature
- US20220418115A1 PACKAGE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2022-12-29
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