Invention Grant
- Patent Title: Substrate for sensing, a method of fabricating the substrate, and analyzing apparatus including the substrate
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Application No.: US17406863Application Date: 2021-08-19
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Publication No.: US12000735B2Publication Date: 2024-06-04
- Inventor: Daejong Yang , Hyunjun Cho , Youngzoon Yoon , Hyuck Choo
- Applicant: SAMSUNG ELECTRONICS CO., LTD. , CALIFORNIA INSTITUTE OF TECHNOLOGY
- Applicant Address: KR CA Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.,CALIFORNIA INSTITUTE OF TECHNOLOGY
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.,CALIFORNIA INSTITUTE OF TECHNOLOGY
- Current Assignee Address: KR Suwon-si; US CA Pasadena
- Agency: Sughrue Mion, PLLC
- Main IPC: G01J3/44
- IPC: G01J3/44 ; B81C1/00 ; B82Y15/00 ; B82Y30/00 ; C23C18/06 ; C23C18/08 ; G01N21/65

Abstract:
A substrate for sensing, a method of manufacturing the substrate, and an analyzing apparatus including the substrate are provided. The substrate for sensing includes: a support layer; a plurality of metal nanoparticle clusters arranged on the support layer; and a plurality of perforations arranged among the plurality of metal nanoparticle clusters. The plurality of metal nanoparticle clusters each comprise a plurality of metal nanoparticles stacked in a three-dimensional structure. Each of the plurality of perforations transmits incident light therethrough.
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