公开(公告)号：US20210381895A1

公开(公告)日：2021-12-09

申请号：US17406863

申请日：2021-08-19

Applicant: Samsung Electronics Co., Ltd. ,  California Institute of Technology

Inventor： Daejong Yang ,  Hyunjun Cho ,  Youngzoon Yoon ,  Hyuck Choo

IPC: G01J3/44 ,  G01N21/65 ,  B82Y15/00 ,  B82Y30/00 ,  B81C1/00 ,  C23C18/06 ,  C23C18/08

Abstract: A substrate for sensing, a method of manufacturing the substrate, and an analyzing apparatus including the substrate are provided. The substrate for sensing includes: a support layer; a plurality of metal nanoparticle clusters arranged on the support layer; and a plurality of perforations arranged among the plurality of metal nanoparticle clusters. The plurality of metal nanoparticle clusters each comprise a plurality of metal nanoparticles stacked in a three-dimensional structure. Each of the plurality of perforations transmits incident light therethrough.

公开(公告)号：US11125620B2

公开(公告)日：2021-09-21

申请号：US15989983

申请日：2018-05-25

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  CALIFORNIA INSTITUTE OF TECHNOLOGY

Inventor： Daejong Yang ,  Hyunjun Cho ,  Youngzoon Yoon ,  Hyuck Choo

IPC: B82Y15/00 ,  B82Y30/00 ,  G01J3/44 ,  G01N21/65 ,  B81C1/00 ,  C23C18/06 ,  C23C18/08

Abstract: A substrate for sensing, a method of manufacturing the substrate, and an analyzing apparatus including the substrate are provided. The substrate for sensing includes: a support layer; a plurality of metal nanoparticle clusters arranged on the support layer; and a plurality of perforations arranged among the plurality of metal nanoparticle clusters. The plurality of metal nanoparticle clusters each comprise a plurality of metal nanoparticles stacked in a three-dimensional structure. Each of the plurality of perforations transmits incident light therethrough.

公开(公告)号：US12000735B2

公开(公告)日：2024-06-04

申请号：US17406863

申请日：2021-08-19

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  CALIFORNIA INSTITUTE OF TECHNOLOGY

Inventor： Daejong Yang ,  Hyunjun Cho ,  Youngzoon Yoon ,  Hyuck Choo

IPC: G01J3/44 ,  B81C1/00 ,  B82Y15/00 ,  B82Y30/00 ,  C23C18/06 ,  C23C18/08 ,  G01N21/65

CPC classification number: G01J3/4412 ,  B81C1/00206 ,  B82Y15/00 ,  B82Y30/00 ,  C23C18/06 ,  C23C18/08 ,  G01N21/658 ,  B81B2203/0361 ,  B81B2207/056 ,  B81C2201/0104

Abstract: A substrate for sensing, a method of manufacturing the substrate, and an analyzing apparatus including the substrate are provided. The substrate for sensing includes: a support layer; a plurality of metal nanoparticle clusters arranged on the support layer; and a plurality of perforations arranged among the plurality of metal nanoparticle clusters. The plurality of metal nanoparticle clusters each comprise a plurality of metal nanoparticles stacked in a three-dimensional structure. Each of the plurality of perforations transmits incident light therethrough.