- 专利标题： Thermal component and electronic device
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申请号： US17596612申请日： 2020-06-17
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公开(公告)号： US12004320B2公开(公告)日： 2024-06-04
- 发明人: Yang Luo , Qi Chen , Haitao Zhen , Zhiguo Zhang , Chao Li
- 申请人： Huawei Technologies Co., Ltd.
- 申请人地址： CN Shenzhen
- 专利权人： Huawei Technologies Co., Ltd.
- 当前专利权人： Huawei Technologies Co., Ltd.
- 当前专利权人地址： CN Shenzhen
- 代理机构： Slater Matsil, LLP
- 优先权： CN 1910526651.7 2019.06.18
- 国际申请： PCT/CN2020/096575 2020.06.17
- 国际公布： WO2020/253723A 2020.12.24
- 进入国家日期： 2021-12-14
- 主分类号： H05K7/20
- IPC分类号： H05K7/20
摘要：
A thermal system includes a system component, a working medium, a second-level thermal component, and a working medium transmission component. The system component includes a first-level thermal component and a working medium driver. The working medium driver is configured to drive the working medium to flow through a primary flow-through structure, a secondary flow-through structure, and a transmission channel in the working medium transmission component, and the thickness of the working medium driver is less than or equal to 5 mm.
公开/授权文献
- US20220304189A1 Thermal Component and Electronic Device 公开/授权日：2022-09-22
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