公开(公告)号：US20220304189A1

公开(公告)日：2022-09-22

申请号：US17596612

申请日：2020-06-17

Applicant: Huawei Technologies Co., Ltd.

Inventor： Yang Luo ,  Qi Chen ,  Haitao Zhen ,  Zhiguo Zhang ,  Chao Li

IPC: H05K7/20

Abstract: A thermal system includes a system component, a working medium, a second-level thermal component, and a working medium transmission component. The system component includes a first-level thermal component and a working medium driver. The working medium driver is configured to drive the working medium to flow through a primary flow-through structure, a secondary flow-through structure, and a transmission channel in the working medium transmission component, and the thickness of the working medium driver is less than or equal to 5 mm.

公开(公告)号：US12004320B2

公开(公告)日：2024-06-04

申请号：US17596612

申请日：2020-06-17

Applicant: Huawei Technologies Co., Ltd.

Inventor： Yang Luo ,  Qi Chen ,  Haitao Zhen ,  Zhiguo Zhang ,  Chao Li

IPC: H05K7/20

CPC classification number: H05K7/20172 ,  H05K7/20336

Abstract: A thermal system includes a system component, a working medium, a second-level thermal component, and a working medium transmission component. The system component includes a first-level thermal component and a working medium driver. The working medium driver is configured to drive the working medium to flow through a primary flow-through structure, a secondary flow-through structure, and a transmission channel in the working medium transmission component, and the thickness of the working medium driver is less than or equal to 5 mm.