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US12027477B2 Method of additively manufacturing an integrated circuit of an interconnect packaging structure 有权

Method of additively manufacturing an integrated circuit of an interconnect packaging structure
摘要：
A method of manufacturing an interconnect packaging structure is provided. In one aspect, the method includes forming a first body defining a cavity around at least one integrated circuit using an additive manufacturing machine, depositing a conductive transmission line on the first body and electrically coupling the conductive transmission line and the at least one integrated circuit with a conductive interconnect.
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