专利检索 ap:("Board of Trustees of Michigan State University") AND inv:"Ioannis Papapolymerou" 第 1 页

1.

发明授权
Method of additively manufacturing an integrated circuit of an interconnect packaging structure 有权

公开(公告)号：US12027477B2

公开(公告)日：2024-07-02

申请号：US17056188

申请日：2019-05-15

申请人： Board of Trustees of Michigan State University

发明人： Ioannis Papapolymerou , Premjeet Chahal , John D. Albrecht , Michael Thomas Craton , Christopher Oakley

IPC分类号： H01L23/66 , B33Y10/00 , B33Y30/00 , G01S7/02 , G01S7/282 , G01S13/931 , H01L23/00

CPC分类号： H01L23/66 , B33Y10/00 , B33Y30/00 , G01S7/028 , G01S7/282 , G01S13/931 , H01L24/06 , H01L24/19 , H01L24/24 , H01L2223/6627 , H01L2223/6644 , H01L2223/6677 , H01L2224/06131 , H01L2224/24227 , H01L2224/24247

摘要： A method of manufacturing an interconnect packaging structure is provided. In one aspect, the method includes forming a first body defining a cavity around at least one integrated circuit using an additive manufacturing machine, depositing a conductive transmission line on the first body and electrically coupling the conductive transmission line and the at least one integrated circuit with a conductive interconnect.