- 专利标题: Memory array circuit and method of manufacturing same
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申请号: US18304301申请日: 2023-04-20
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公开(公告)号: US12029023B2公开(公告)日: 2024-07-02
- 发明人: Hidehiro Fujiwara , Chih-Yu Lin , Hsien-Yu Pan , Yasutoshi Okuno , Yen-Huei Chen , Hung-Jen Liao
- 申请人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 申请人地址: TW Hsinchu
- 专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人地址: TW Hsinchu
- 代理机构: Hauptman Ham, LLP
- 分案原申请号: US16457553 2019.06.28
- 主分类号: H10B10/00
- IPC分类号: H10B10/00 ; G06F30/392 ; H01L23/522 ; H01L23/528 ; H01L27/02
摘要:
A method of forming a memory circuit includes generating a layout design of the memory circuit, and manufacturing the memory circuit based on the layout design. The generating of the layout design includes generating a first active region layout pattern corresponding to fabricating a first active region of a first pull down transistor, generating a second active region layout pattern corresponding to fabricating a second active region of a first pass gate transistor, and generating a first metal contact layout pattern corresponding to fabricating a first metal contact. The first metal contact layout pattern overlaps the cell boundary of the memory circuit and the first active region layout pattern. The first metal contact electrically coupled to a source of the first pull down transistor. The memory circuit being a four transistor (4T) memory cell including a first and second pass gate transistor, and a first and second pull down transistor.
公开/授权文献
- US20230301049A1 MEMORY ARRAY CIRCUIT AND METHOD OF MANUFACTURING SAME 公开/授权日:2023-09-21
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